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IRFP4229PBF PDF预览

IRFP4229PBF

更新时间: 2023-12-18 00:00:00
品牌 Logo 应用领域
英飞凌 - INFINEON 晶体开关晶体管脉冲光电二极管局域网
页数 文件大小 规格书
8页 283K
描述
PDP SWITCH

IRFP4229PBF 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Transferred零件包装代码:TO-247AC
包装说明:LEAD FREE PACKAGE-3针数:3
Reach Compliance Code:unknownECCN代码:EAR99
风险等级:3.87雪崩能效等级(Eas):300 mJ
外壳连接:DRAIN配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:250 V最大漏极电流 (Abs) (ID):44 A
最大漏极电流 (ID):44 A最大漏源导通电阻:0.046 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJEDEC-95代码:TO-247AC
JESD-30 代码:R-PSFM-T3JESD-609代码:e3
元件数量:1端子数量:3
工作模式:ENHANCEMENT MODE最高工作温度:175 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:FLANGE MOUNT峰值回流温度(摄氏度):250
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):310 W
最大脉冲漏极电流 (IDM):180 A认证状态:Not Qualified
子类别:FET General Purpose Power表面贴装:NO
端子面层:Matte Tin (Sn) - with Nickel (Ni) barrier端子形式:THROUGH-HOLE
端子位置:SINGLE处于峰值回流温度下的最长时间:30
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

IRFP4229PBF 数据手册

 浏览型号IRFP4229PBF的Datasheet PDF文件第2页浏览型号IRFP4229PBF的Datasheet PDF文件第3页浏览型号IRFP4229PBF的Datasheet PDF文件第4页浏览型号IRFP4229PBF的Datasheet PDF文件第5页浏览型号IRFP4229PBF的Datasheet PDF文件第6页浏览型号IRFP4229PBF的Datasheet PDF文件第7页 
PD - 97079A  
IRFP4229PbF  
PDP SWITCH  
Features  
Key Parameters  
l
Advanced Process Technology  
VDS min  
250  
300  
38  
V
V
m
l
Key Parameters Optimized for PDP Sustain,  
Energy Recovery and Pass Switch Applications  
Low EPULSE Rating to Reduce Power  
Dissipation in PDP Sustain, Energy Recovery  
and Pass Switch Applications  
VDS (Avalanche) typ.  
RDS(ON) typ. @ 10V  
IRP max @ TC= 100°C  
TJ max  
l
87  
A
175  
°C  
l
l
Low QG for Fast Response  
High Repetitive Peak Current Capability for  
Reliable Operation  
D
D
l
Short Fall & Rise Times for Fast Switching  
l
175°C Operating Junction Temperature for  
Improved Ruggedness  
Repetitive Avalanche Capability for Robustness  
S
D
G
G
l
and Reliability  
S
TO-247AC  
G
D
S
Gate  
Drain  
Source  
Description  
This HEXFET® Power MOSFET is specifically designed for Sustain; Energy Recovery & Pass switch  
applicationsinPlasmaDisplayPanels. ThisMOSFETutilizesthelatestprocessingtechniquestoachieve  
low on-resistance per silicon area and low EPULSE rating. Additional features of this MOSFET are 175°C  
operating junction temperature and high repetitive peak current capability. These features combine to  
make this MOSFET a highly efficient, robust and reliable device for PDP driving applications.  
Absolute Maximum Ratings  
Max.  
Parameter  
Units  
VGS  
±30  
Gate-to-Source Voltage  
V
ID @ TC = 25°C  
ID @ TC = 100°C  
IDM  
Continuous Drain Current, VGS @ 10V  
Continuous Drain Current, VGS @ 10V  
Pulsed Drain Current  
44  
A
31  
180  
IRP @ TC = 100°C  
PD @TC = 25°C  
PD @TC = 100°C  
87  
Repetitive Peak Current  
310  
Power Dissipation  
W
150  
Power Dissipation  
2.0  
Linear Derating Factor  
W/°C  
°C  
TJ  
-40 to + 175  
Operating Junction and  
TSTG  
Storage Temperature Range  
Soldering Temperature for 10 seconds  
Mounting Torque, 6-32 or M3 Screw  
300  
10lb in (1.1N m)  
N
Thermal Resistance  
Parameter  
Typ.  
Max.  
0.49  
–––  
40  
Units  
Junction-to-Case  
Rθ  
Rθ  
Rθ  
–––  
0.24  
–––  
JC  
CS  
JA  
Case-to-Sink, Flat, Greased Surface  
Junction-to-Ambient  
°C/W  
Notes  through are on page 8  
www.irf.com  
1
01/29/07  

IRFP4229PBF 替代型号

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