IRFP350LC, SiHFP350LC
Vishay Siliconix
Power MOSFET
FEATURES
PRODUCT SUMMARY
VDS (V)
• Ultra Low Gate Charge
• Reduced Gate Drive Requirement
• Enhanced 30V VGS Rating
• Reduced Ciss, Coss, Crss
• Isolated Central Mounting Hole
• Dynamic dV/dt Rated
400
Available
RDS(on) (Ω)
VGS = 10 V
0.30
RoHS*
COMPLIANT
Qg (Max.) (nC)
76
20
Q
Q
gs (nC)
gd (nC)
37
• Repetitive Avalanche Rated
• Lead (Pb)-free Available
Configuration
Single
D
DESCRIPTION
TO-247
This new series of low charge Power MOSFETs achieve
significantly lower gate charge over conventional MOSFETs.
Utilizing advanced MOSFETs technology the device
improvements allow for reduced gate drive requirements,
faster switching speeds and increased total system savings.
These device improvements combined with the proven
ruggedness and reliability of MOSFETs offer the designer a
new standard in power transistors for switching applications.
The TO-247 package is preferred for commercial-industrial
applications where higher power levels preclude the use of
TO-220 devices. The TO-247 is similar but superior to the
earlier TO-218 package because of its isolated mounting
hole.
G
S
D
G
S
N-Channel MOSFET
ORDERING INFORMATION
Package
TO-247
IRFP350LCPbF
SiHFP350LC-E3
IRFP350LC
Lead (Pb)-free
SnPb
SiHFP350LC
ABSOLUTE MAXIMUM RATINGS TC = 25 °C, unless otherwise noted
PARAMETER
SYMBOL
LIMIT
UNIT
Drain-Source Voltage
Gate-Source Voltage
VDS
400
V
VGS
30
T
C = 25 °C
16
Continuous Drain Current
V
GS at 10 V
ID
TC =100°C
9.9
A
Pulsed Drain Currenta
IDM
64
Linear Derating Factor
1.5
W/°C
mJ
A
Single Pulse Avalanche Energyb
Repetitive Avalanche Currenta
Repetitive Avalanche Energya
EAS
IAR
390
16
EAR
19
190
mJ
W
Maximum Power Dissipation
TC = 25 °C
PD
Peak Diode Recovery dV/dtc
dV/dt
TJ, Tstg
4.0
V/ns
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)
- 55 to + 150
300d
°C
for 10 s
10
lbf · in
N · m
Mounting Torque
6-32 or M3 screw
1.1
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).
b. VDD = 25 V, starting TJ = 25 °C, L = 2.7 µH, RG = 25 Ω, IAS = 16 A (see fig. 12).
c. ISD ≤ 16 A, dI/dt ≤ 200 A/µs, VDD ≤ VDS, TJ ≤ 150 °C.
d. 1.6 mm from case.
* Pb containing terminations are not RoHS compliant, exemptions may apply
Document Number: 91224
S-Pending-Rev. A, 16-Jun-08
www.vishay.com
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