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IRFP350 PDF预览

IRFP350

更新时间: 2024-01-17 16:51:49
品牌 Logo 应用领域
威世 - VISHAY 晶体晶体管功率场效应晶体管开关脉冲局域网
页数 文件大小 规格书
8页 1569K
描述
Power MOSFET

IRFP350 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
包装说明:FLANGE MOUNT, R-PSFM-T3Reach Compliance Code:unknown
风险等级:5.88雪崩能效等级(Eas):700 mJ
外壳连接:DRAIN配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:400 V最大漏极电流 (Abs) (ID):16 A
最大漏极电流 (ID):16 A最大漏源导通电阻:0.3 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJEDEC-95代码:TO-247
JESD-30 代码:R-PSFM-T3JESD-609代码:e0
元件数量:1端子数量:3
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:FLANGE MOUNT峰值回流温度(摄氏度):NOT SPECIFIED
极性/信道类型:N-CHANNEL功耗环境最大值:180 W
最大功率耗散 (Abs):180 W最大脉冲漏极电流 (IDM):64 A
认证状态:Not Qualified子类别:FET General Purpose Power
表面贴装:NO端子面层:Tin/Lead (Sn/Pb)
端子形式:THROUGH-HOLE端子位置:SINGLE
处于峰值回流温度下的最长时间:NOT SPECIFIED晶体管应用:SWITCHING
晶体管元件材料:SILICON最大关闭时间(toff):181 ns
最大开启时间(吨):95 ns

IRFP350 数据手册

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IRFP350, SiHFP350  
Vishay Siliconix  
Power MOSFET  
FEATURES  
• Dynamic dV/dt Rating  
PRODUCT SUMMARY  
VDS (V)  
400  
Available  
• Repetitive Avalanche Rated  
• Isolated Central Mounting Hole  
• Fast Switching  
RDS(on) (Ω)  
VGS = 10 V  
0.30  
RoHS*  
COMPLIANT  
Qg (Max.) (nC)  
150  
23  
Q
Q
gs (nC)  
gd (nC)  
• Ease of Paralleling  
80  
• Simple Drive Requirements  
• Lead (Pb)-free Available  
Configuration  
Single  
D
DESCRIPTION  
TO-247  
Third generation Power MOSFETs from Vishay provide the  
designer with the best combination of fast switching,  
ruggedized device design, low on-resistance and  
cost-effectiveness.  
G
The TO-247 package is preferred for commercial-industrial  
applications where higher power levels preclude the use of  
TO-220 devices. The TO-247 is similar but superior to the  
earlier TO-218 package because of its isolated mounting  
hole. It also provides greater creepage distance between  
pins to meet the requirements of most safety specifications.  
S
D
S
N-Channel MOSFET  
G
ORDERING INFORMATION  
Package  
TO-247  
IRFP350PbF  
SiHFP350-E3  
IRFP350  
Lead (Pb)-free  
SnPb  
SiHFP350  
ABSOLUTE MAXIMUM RATINGS TC = 25 °C, unless otherwise noted  
PARAMETER  
SYMBOL  
LIMIT  
UNIT  
Drain-Source Voltage  
Gate-Source Voltage  
VDS  
400  
V
VGS  
20  
T
C = 25 °C  
16  
Continuous Drain Current  
VGS at 10 V  
ID  
TC =100°C  
10  
A
Pulsed Drain Currenta  
IDM  
64  
Linear Derating Factor  
1.5  
W/°C  
mJ  
A
Single Pulse Avalanche Energyb  
Repetitive Avalanche Currenta  
Repetitive Avalanche Energya  
EAS  
IAR  
390  
16  
EAR  
19  
190  
mJ  
W
Maximum Power Dissipation  
T
C = 25 °C  
PD  
Peak Diode Recovery dV/dtc  
dV/dt  
TJ, Tstg  
4.0  
V/ns  
Operating Junction and Storage Temperature Range  
Soldering Recommendations (Peak Temperature)  
- 55 to + 150  
300d  
°C  
for 10 s  
6-32 or M3 screw  
10  
lbf · in  
N · m  
Mounting Torque  
1.1  
Notes  
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).  
b. VDD = 50 V, starting TJ = 25 °C, L = 2.7 mH, RG = 25 Ω, IAS = 16 A (see fig. 12).  
c. ISD 16 A, dI/dt 200 A/µs, VDD VDS, TJ 150 °C.  
d. 1.6 mm from case.  
* Pb containing terminations are not RoHS compliant, exemptions may apply  
Document Number: 91225  
S-81360-Rev. A, 28-Jul-08  
www.vishay.com  
1

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