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IRFP260M PDF预览

IRFP260M

更新时间: 2024-11-03 14:54:59
品牌 Logo 应用领域
英飞凌 - INFINEON /
页数 文件大小 规格书
9页 1130K
描述
The IR MOSFET family of power MOSFETs utilizes proven silicon processes offering designers a wide portfolio of devices to support various applications such as DC motors, inverters, SMPS, lighting, load switches as well as battery powered applications.The devices are available in a variety of surface mount and through-hole packages with industry standard footprints for ease of design.?

IRFP260M 数据手册

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IRFP260MPbF  
IR MOSFET™  
Features  
Advanced Process Technology  
V(BR)DSS  
200V  
0.04  
50A  
Dynamic dv/dt Rating  
175°C Operating Temperature  
Fast Switching  
Fully Avalanche Rated  
Ease of Paralleling  
RDS(on) max.  
ID  
Simple Drive Requirements  
Lead-Free  
Description  
IR MOSFETtechnology from Infineon utilizes  
advanced processing techniques to achieve  
extremely low on-resistance per silicon area. This  
benefit, combined with the fast switching speed and  
rugged device design that IR MOSFETdevices are  
well known for, provides the designer with an  
extremely efficient and reliable device for use in a  
wide variety of applications.  
TO-247AD  
G
D
S
Gate  
Drain  
Source  
The TO-247 package is preferred for commercial-  
industrial applications where higher power levels  
preclude the use of TO-220 devices. The TO-247 is  
similar but superior to the earlier TO-218 package  
because of its isolated mounting hole.  
Standard Pack  
Form  
Base part number  
Package Type  
Orderable Part Number  
Quantity  
IRFP260MPbF  
TO-247AD  
Tube  
25  
IRFP260MPbF  
Absolute Maximum Ratings  
Symbol  
Parameter  
Max.  
Units  
ID @ TC = 25°C  
ID @ TC = 100°C  
IDM  
Continuous Drain Current, VGS @ 10V  
Continuous Drain Current, VGS @ 10V  
Pulsed Drain Current   
50  
35  
A
200  
300  
W
PD @TC = 25°C  
Maximum Power Dissipation  
W/°C  
Linear Derating Factor  
2.0  
± 20  
560  
50  
V
mJ  
A
VGS  
EAS  
IAR  
Gate-to-Source Voltage  
Single Pulse Avalanche Energy   
Avalanche Current   
mJ  
V/ns  
EAR  
dv/dt  
TJ  
Repetitive Avalanche Energy   
Peak Diode Recovery dv/dt  
Operating Junction and  
30  
10  
-55 to + 175  
°C  
TSTG  
Storage Temperature Range  
Soldering Temperature, for 10 seconds (1.6mm from case)  
300  
Mounting torque, 6-32 or M3 screw  
10 lbfin (1.1Nm)  
Thermal Resistance  
Symbol  
Parameter  
Junction-to-Case  
Typ.  
Max.  
0.50  
–––  
40  
Units  
–––  
0.24  
–––  
RJC  
RCS  
RJA  
Case-to-Sink, Flat, Greased Surface  
Junction-to-Ambient  
°C/W  
1
2020-05-28  

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