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IRFP140N-R4942 PDF预览

IRFP140N-R4942

更新时间: 2024-11-05 20:11:39
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飞兆/仙童 - FAIRCHILD /
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10页 137K
描述
Transistor

IRFP140N-R4942 技术参数

生命周期:Obsolete包装说明:,
Reach Compliance Code:unknown风险等级:5.84
Base Number Matches:1

IRFP140N-R4942 数据手册

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IRFP140N  
Data Sheet  
January 2002  
33A, 100V, 0.040 Ohm, N-Channel Power MOSFET  
Packaging  
Features  
JEDEC TO-247  
• Ultra Low On-Resistance  
- r  
DS(ON)  
= 0.040Ω, V = 10V  
GS  
SOURCE  
DRAIN  
GATE  
• Simulation Models  
©
- Temperature Compensated PSPICE™ and SABER  
Electrical Models  
©
- Spice and SABER Thermal Impedance Models  
- www.fairchildsemi.com  
• Peak Current vs Pulse Width Curve  
• UIS Rating Curve  
DRAIN  
(TAB)  
Ordering Information  
Symbol  
PART NUMBER  
PACKAGE  
TO-247  
BRAND  
IRFP140N  
D
IRFP140N  
G
S
o
Absolute Maximum Ratings  
T = 25 C, Unless Otherwise Specified  
C
IRFP140N  
UNITS  
Drain to Source Voltage (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V  
100  
100  
20  
V
V
V
DSS  
Drain to Gate Voltage (R  
= 20k) (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V  
GS  
DGR  
Gate to Source Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V  
GS  
Drain Current  
o
Continuous (T = 25 C, V  
C
= 10V) (Figure 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I  
33  
23  
A
A
GS  
D
D
o
Continuous (T = 100 C, V  
= 10V) (Figure 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I  
C
GS  
Pulsed Drain Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .I  
Figure 4  
DM  
Pulsed Avalanche Rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .UIS  
Figures 6, 14, 15  
Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . P  
Derate Above 25 C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  
120  
0.80  
W
W/ C  
D
o
o
o
Operating and Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T , T  
J
-55 to 175  
C
STG  
Maximum Temperature for Soldering  
Leads at 0.063in (1.6mm) from Case for 10s. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .T  
Package Body for 10s, See Techbrief TB334 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T  
o
o
300  
260  
C
C
L
pkg  
NOTES:  
1. T = 25 C to 150 C.  
o
o
J
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the  
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.  
©2002 Fairchild Semiconductor Corporation  
IRFP140N Rev. B  

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