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IRFI734G PDF预览

IRFI734G

更新时间: 2024-11-30 05:39:27
品牌 Logo 应用领域
威世 - VISHAY 晶体晶体管功率场效应晶体管开关局域网
页数 文件大小 规格书
8页 874K
描述
Power MOSFET

IRFI734G 技术参数

是否Rohs认证:不符合生命周期:Obsolete
零件包装代码:TO-220AB包装说明:FLANGE MOUNT, R-PSFM-T3
针数:3Reach Compliance Code:unknown
风险等级:5.09Is Samacsys:N
外壳连接:ISOLATED配置:SINGLE
最小漏源击穿电压:450 V最大漏极电流 (Abs) (ID):3.4 A
最大漏极电流 (ID):3.4 A最大漏源导通电阻:1.2 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJEDEC-95代码:TO-220AB
JESD-30 代码:R-PSFM-T3JESD-609代码:e0
元件数量:1端子数量:3
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:FLANGE MOUNT峰值回流温度(摄氏度):NOT SPECIFIED
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):35 W
认证状态:Not Qualified子类别:FET General Purpose Power
表面贴装:NO端子面层:TIN LEAD
端子形式:THROUGH-HOLE端子位置:SINGLE
处于峰值回流温度下的最长时间:NOT SPECIFIED晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

IRFI734G 数据手册

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IRFI734G, SiHFI734G  
Vishay Siliconix  
Power MOSFET  
FEATURES  
PRODUCT SUMMARY  
VDS (V)  
• Isolated Package  
450  
• High Voltage Isolation = 2.5 kVRMS (t = 60 s;  
f = 60 Hz)  
RDS(on) (Ω)  
VGS = 10 V  
1.2  
RoHS  
• Sink to Lead Creepage Dist. 4.8 mm  
• Dynamic dV/dt  
• Low Thermal Resistance  
• Lead (Pb)-free  
COMPLIANT  
Qg (Max.) (nC)  
45  
6.6  
Q
Q
gs (nC)  
gd (nC)  
24  
Configuration  
Single  
DESCRIPTION  
D
Third generation Power MOSFETs from Vishay provide the  
designer with the best combination of fast switching,  
ruggedized device design, low on-resistance and  
cost-effectiveness.  
TO-220 FULLPAK  
The TO-220 FULLPAK eliminates the need for additional  
insulating hardware in commercial-industrial applications.  
The molding compound used provides a high isolation  
capability and a low thermal resistance between the tab and  
external heatsink. This isolation is equivalent to using a 100  
micron mica barrier with standard TO-220 product. The  
FULLPAK is mounted to a heatsink using a single clip or by  
a single screw fixing.  
G
S
S
D
G
N-Channel MOSFET  
ORDERING INFORMATION  
Package  
TO-220 FULLPAK  
IRFI734GPbF  
Lead (Pb)-free  
SiHFI734G-E3  
ABSOLUTE MAXIMUM RATINGS TC = 25 °C, unless otherwise noted  
PARAMETER  
SYMBOL  
LIMIT  
450  
UNIT  
Drain-Source Voltage  
Gate-Source Voltage  
VDS  
V
VGS  
20  
T
C = 25 °C  
3.4  
Continuous Drain Current  
VGS at 10 V  
ID  
A
TC =100°C  
2.1  
Pulsed Drain Currenta  
IDM  
14  
Linear Derating Factor  
0.28  
100  
W/°C  
mJ  
A
Single Pulse Avalanche Energyb  
Repetitive Avalanche Currenta  
Repetitive Avalanche Energya  
EAS  
IAR  
3.4  
EAR  
3.5  
mJ  
W
Maximum Power Dissipation  
T
C = 25 °C  
PD  
35  
Peak Diode Recovery dV/dtc  
dV/dt  
TJ, Tstg  
4.0  
V/ns  
Operating Junction and Storage Temperature Range  
Soldering Recommendations (Peak Temperature)  
- 55 to + 150  
300d  
10  
°C  
for 10 s  
6-32 or M3 screw  
lbf · in  
N · m  
Mounting Torque  
1.1  
Notes  
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).  
b. VDD = 50 V, starting TJ = 25 °C, L = 15 mH, RG = 25 Ω, IAS = 3.4 A (see fig. 12).  
c. ISD 4.9 A, dI/dt 80 A/µs, VDD VDS, TJ 150 °C.  
d. 1.6 mm from case.  
Document Number: 91154  
S-Pending-Rev. A, 16-Jun-08  
www.vishay.com  
1
WORK-IN-PROGRESS  

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