PD - 97581A
IRFHS9301PbF
HEXFET® Power MOSFET
VDS
TOP VIEW
-30
V
V
VGS max
±20
D
D
D
1
2
6
5
4
D
D
S
RDS(on) max
(@VGS = -10V)
D
37
13
mΩ
nC
A
G
D
D
Qg (typical)
D
D
S
S
ID
S
G 3
-8.5
2mm x 2mm PQFN
(@TC = 25°C)
Applications
l Charge and Discharge Switch for Battery Application
l System/load switch
Features and Benefits
Features
Low RDSon (≤ 37mΩ)
Low Thermal Resistance to PCB (≤ 13°C/W)
Low Profile (≤ 1.0 mm)
Compatible with Existing Surface Mount Techniques
Benefits
Lower Conduction Losses
Enable better thermal dissipation
results inIncreased Power Density
Easier Manufacturing
Environmentally Friendlier
Increased Reliability
RoHS Compliant Containing no Lead, no Bromide and no Halogen
MSL1, Consumer Qualification
Orderable part number
Package Type
Standard Pack
Note
Form
Tape and Reel
Tape and Reel
Quantity
4000
IRFHS9301TRPBF
IRFHS9301TR2PBF
PQFN 2mm x 2mm
PQFN 2mm x 2mm
400
Absolute Maximum Ratings
Parameter
Drain-to-Source Voltage
Gate-to-Source Voltage
Max.
-30
Units
VDS
V
VGS
± 20
-6.0
-4.8
-13
ID @ TA = 25°C
ID @ TA = 70°C
ID @ TC = 25°C
ID @ TC = 70°C
ID @ TC = 25°C
IDM
Continuous Drain Current, VGS @ -10V
Continuous Drain Current, VGS @ -10V
Continuous Drain Current, VGS @ -10V
Continuous Drain Current, VGS @ -10V
A
-10
Continuous Drain Current, VGS @ 10V (Package Limited)
Pulsed Drain Current
-8.5
-52
2.1
1.3
Power Dissipation
PD @TA = 25°C
PD @ TA = 70°C
W
Power Dissipation
Linear Derating Factor
Operating Junction and
0.02
-55 to + 150
W/°C
°C
TJ
TSTG
Storage Temperature Range
Notes through ꢀ are on page 2
www.irf.com
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