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IRFD9024 PDF预览

IRFD9024

更新时间: 2024-09-30 14:55:23
品牌 Logo 应用领域
威世 - VISHAY /
页数 文件大小 规格书
9页 826K
描述
Power MOSFET

IRFD9024 技术参数

是否无铅: 含铅是否Rohs认证: 不符合
生命周期:Obsolete零件包装代码:DIP
包装说明:IN-LINE, R-PDIP-T3针数:4
Reach Compliance Code:unknownECCN代码:EAR99
风险等级:5.16雪崩能效等级(Eas):140 mJ
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:60 V
最大漏极电流 (Abs) (ID):1.6 A最大漏极电流 (ID):1.6 A
最大漏源导通电阻:0.28 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JESD-30 代码:R-PDIP-T3JESD-609代码:e0
元件数量:1端子数量:3
工作模式:ENHANCEMENT MODE最高工作温度:175 °C
最低工作温度:-55 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:IN-LINE
峰值回流温度(摄氏度):NOT APPLICABLE极性/信道类型:P-CHANNEL
最大功率耗散 (Abs):1.3 W最大脉冲漏极电流 (IDM):13 A
认证状态:Not Qualified子类别:Other Transistors
表面贴装:NO端子面层:Tin/Lead (Sn/Pb)
端子形式:THROUGH-HOLE端子位置:DUAL
处于峰值回流温度下的最长时间:NOT APPLICABLE晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

IRFD9024 数据手册

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IRFD9024  
Vishay Siliconix  
www.vishay.com  
Power MOSFET  
FEATURES  
S
• Dynamic dV/dt rating  
HVMDIP  
• Repetitive avalanche rated  
• For automatic insertion  
• End stackable  
G
• P-channel  
S
G
• Fast switching  
D
D
• 175 °C operating temperature  
P-Channel MOSFET  
• Material categorization: for definitions of compliance  
please see www.vishay.com/doc?99912  
PRODUCT SUMMARY  
VDS (V)  
DESCRIPTION  
-60  
Third generation power MOSFETs from Vishay provide the  
designer with the best combination of fast switching,  
ruggedized device design, low on-resistance and  
cost-effectiveness.  
R
DS(on) (Ω)  
Qg (Max.) (nC)  
gs (nC)  
VGS = -10 V  
0.28  
19  
5.4  
11  
Q
The 4 pin DIP package is a low cost machine-insertable  
case style which can be stacked in multiple combinations on  
standard 0.1" pin centers. The dual drain servers as a  
thermal link to the mounting surface for power dissipation  
levels up to 1 W.  
Qgd (nC)  
Configuration  
Single  
ORDERING INFORMATION  
Package  
HVMDIP  
Lead (Pb)-free  
IRFD9024PbF  
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise noted)  
PARAMETER  
SYMBOL  
LIMIT  
-60  
UNIT  
Drain-source voltage  
Gate-source voltage  
VDS  
V
VGS  
20  
TA = 25 °C  
-1.6  
Continuous drain current  
VGS at -10 V  
ID  
TA = 100 °C  
-1.1  
A
Pulsed drain current a  
IDM  
-13  
Linear derating factor  
0.0083  
140  
W/°C  
mJ  
A
Single pulse avalanche energy b  
Repetitive avalanche current a  
Repetitive avalanche energy a  
Maximum power dissipation  
EAS  
IAR  
-1.6  
EAR  
0.13  
mJ  
W
TA = 25 °C  
PD  
1.3  
Peak diode recovery dv/dt c  
dV/dt  
TJ, Tstg  
-4.5  
V/ns  
Operating junction and storage temperature range  
Soldering rRecommendations (peak temperature)  
-55 to + 175  
300d  
°C  
d
For 10 s  
Notes  
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11)  
b. VDD = -25 V, starting TJ = 25 °C, L = 15 mH, Rg = 25 Ω, IAS = -3.2 A (see fig. 12)  
c. ISD -11 A, dI/dt 140 A/μs, VDD VDS, TJ 175 °C  
d. 1.6 mm from case  
S21-0887-Rev. D, 30-Aug-2021  
Document Number: 91137  
1
For technical questions, contact: hvm@vishay.com  
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  

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