IRFBF20S, SiHFBF20S, IRFBF20L, SiHFBF20L
www.vishay.com
Vishay Siliconix
Power MOSFET
FEATURES
D
• Surface-mount (IRFBF20S, SiHFBF20S)
D2PAK (TO-263)
I2PAK (TO-262)
•
•
Low-profile through-hole (IRFBF20L, SiHFBF20L)
Available in tape and reel (IRFBF20S, SiHFBF20S)
Available
Available
• Dynamic dV/dt rating
• 150 °C operating temperature
• Fast switching
G
G
D
S
• Fully avalanche rated
D
S
G
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
Note
S
*
This datasheet provides information about parts that are
N-Channel MOSFET
RoHS-compliant and / or parts that are non RoHS-compliant. For
example, parts with lead (Pb) terminations are not RoHS-compliant.
Please see the information / tables in this datasheet for details
DESCRIPTION
PRODUCT SUMMARY
Third generation power MOSFETs form Vishay provide the
designer with the best combination of fast switching,
ruggedized device design, low on-resistance and
cost-effectiveness.
VDS (V)
900
8.0
RDS(on) ()
VGS = 10 V
Qg max. (nC)
38
The D2PAK is a surface-mount power package capable of
the accommodating die sizes up to HEX-4. It provides the
highest power capability and the lowest possible
on-resistance in any existing surface-mount package. The
D2PAK is suitable for high current applications because of
its low internal connection resistance and can dissipate up
to 2.0 W in a typical surface-mount application. The
through-hole version (IRFBF20L, SiHFBF20L) is available for
low-profile applications.
Q
gs (nC)
gd (nC)
4.7
Q
21
Configuration
Single
ORDERING INFORMATION
Package
D2PAK (TO-263)
D2PAK (TO-263)
SiHFBF20STRL-GE3 a
IRFBF20STRLPbF a
D2PAK (TO-263)
SiHFBF20STRR-GE3 a
IRFBF20STRRPbF a
I2PAK (TO-262)
SiHFBF20L-GE3
IRFBF20LPbF
Lead (Pb)-free and Halogen-free
Lead (Pb)-free
SiHFBF20S-GE3
IRFBF20SPbF
Note
a. See device orientation
ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted)
PARAMETER
Drain-source voltage e
Gate-source voltage e
SYMBOL
LIMIT
900
20
UNIT
VDS
V
VGS
T
C = 25 °C
1.7
Continuous drain current
VGS at 10 V
ID
TC = 100 °C
1.1
A
Pulsed drain current a, e
IDM
6.8
Linear derating factor
0.43
180
1.7
W/°C
mJ
A
Single pulse avalanche energy b, e
Repetitive avalanche current a
Repetitive avalanche energy a
EAS
IAR
EAR
5.4
mJ
T
C = 25 °C
54
Maximum power dissipation
PD
W
V/ns
°C
TA = 25 °C
3.1
Peak diode recovery dV/dt c, e
dV/dt
1.5
Operating junction and storage temperature range
Soldering recommendations (peak temperature) d
Mounting torque
TJ, Tstg
-55 to +150
300
10
for 10 s
6-32 or M3 screw
N
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11)
b. VDD = 50 V; starting TJ = 25 °C, L = 117 mH, Rg = 25 , IAS = 1.7 A (see fig. 12)
c. ISD 1.7 A, dI/dt 70 A/μs, VDD VDS, TJ 150 °C
d. 1.6 mm from case
e. Uses IRFBF20, SiHFBF20 data and test conditions
S20-0238-Rev. C, 13-Apr-2020
Document Number: 91121
1
For technical questions, contact: hvm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000