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IRFB4332 PDF预览

IRFB4332

更新时间: 2024-11-25 11:14:23
品牌 Logo 应用领域
英飞凌 - INFINEON /
页数 文件大小 规格书
10页 528K
描述
The StrongIRFET™ power MOSFET family is optimized for low RDS(on) and high current capability. The devices are ideal for low frequency applications requiring performance and ruggedness. The comprehensive portfolio addresses a broad range of applications including DC motors, battery management systems, inverters, and DC-DC converters. 

IRFB4332 数据手册

 浏览型号IRFB4332的Datasheet PDF文件第2页浏览型号IRFB4332的Datasheet PDF文件第3页浏览型号IRFB4332的Datasheet PDF文件第4页浏览型号IRFB4332的Datasheet PDF文件第5页浏览型号IRFB4332的Datasheet PDF文件第6页浏览型号IRFB4332的Datasheet PDF文件第7页 
PDP SWITCH  
IRFB4332PbF  
HEXFET® Power MOSFET  
Key Parameters  
250  
Feature  
Advanced Process Technology  
Key Parameters Optimized for PDP Sustain, Energy  
Recovery and Pass Switch Applications  
Low EPULSE Rating to Reduce Power Dissipation in PDP  
Sustain, Energy Recovery and Pass Switch Applications  
Low QG for Fast Response  
VDS min  
V
V
VDS(Avalanche) typ.  
300  
R
DS(on) typ. @ 10V  
29  
m  
TJ max  
175  
°C  
High Repetitive Peak Current Capability for Reliable  
Operation  
D
Short Fall & Rise Times for Fast Switching  
175°C Operating Junction Temperature for Improved  
Ruggedness  
S
D
Repetitive Avalanche Capability for Robustness and  
Reliability  
G
TO-220AB  
IRFB4332PbF  
G
D
S
Gate  
Drain  
Source  
Standard Pack  
Base part number  
IRFB4332PbF  
Package Type  
Orderable Part Number  
Form  
Quantity  
TO-220  
Tube  
50  
IRFB4332PbF  
Description  
This HEXFET® Power MOSFET is specifically designed for Sustain; Energy Recovery & Pass switch applications in  
Plasma Display Panels. This MOSFET utilizes the latest processing techniques to achieve low on-resistance per silicon  
area and low EPULSE rating. Additional features of this MOSFET are 175°C operating junction temperature and high  
repetitive peak current capability. These features combine to make this MOSFET a highly efficient, robust and reliable  
device for PDP driving applications.  
Absolute Maximum Ratings  
Symbol  
Parameter  
Max.  
Units  
VGS  
Gate-to-Source Voltage  
± 30  
V
ID @ TC = 25°C  
Continuous Drain Current, VGS @ 10V  
60  
ID @ TC = 100°C  
IDM  
Continuous Drain Current, VGS @ 10V  
Pulsed Drain Current  
42  
230  
A
I
RP @ TC = 100°C  
Repetitive Peak Current   
Maximum Power Dissipation  
Maximum Power Dissipation  
Linear Derating Factor  
120  
PD @TC = 25°C  
PD @TC = 100°C  
390  
W
W
200  
2.6  
W/°C  
TJ  
Operating Junction and  
-55 to + 175  
TSTG  
Storage Temperature Range  
°C  
Soldering Temperature, for 10 seconds (1.6mm from case)  
Mounting torque, 6-32 or M3 screw  
300  
10 lbf•in (1.1N•m)  
Thermal Resistance  
Symbol  
Parameter  
Junction-to-Case   
Typ.  
–––  
Max.  
Units  
0.38  
–––  
62  
RJC  
RCS  
RJA  
Case-to-Sink, Flat, Greased Surface  
Junction-to-Ambient  
0.50  
–––  
°C/W  
Notes through are on page 2.  
1
2019-08-16  

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