Datasheet > IRFB3307Z

IRFB3307Z

更新时间： 2024-11-19 14:54:51

品牌	Logo	应用领域
英飞凌 - INFINEON		/
页数	文件大小	规格书
12页	321K
描述
The StrongIRFET? power MOSFET family is optimized for low RDS(on) and high current capability. The devices are ideal for low frequency applications requiring performance and ruggedness. The comprehensive portfolio addresses a broad range of applications including DC motors, battery management systems, inverters, and DC-DC converters.?

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IRFB3307Z 数据手册

PD - 97214D

IRFB3307ZPbF

IRFS3307ZPbF

Applications

l High Efficiency Synchronous Rectification in

IRFSL3307ZPbF

SMPS

HEXFET^®Power MOSFET

l Uninterruptible Power Supply

l High Speed Power Switching

l Hard Switched and High Frequency Circuits

V_DSS

R_DS(on)typ.

max.

I_{D (Silicon Limited)}

I_{D (Package Limited)}

75V

4.6m

5.8m

128A

Benefits

120A

l Improved Gate, Avalanche and Dynamic

dv/dt Ruggedness

l Fully Characterized Capacitance and

Avalanche SOA

l Enhanced body diode dV/dt and dI/dt

Capability

D²Pak

TO-262

TO-220AB

IRFB3307ZPbF

IRFS3307ZPbF

IRFSL3307ZPbF

Gate

Drain

Source

Absolute Maximum Ratings

Symbol

Parameter

Max.

128

Units

I_D@ T_C= 25°C

Continuous Drain Current, V_GS@ 10V (Silicon Limited)

Continuous Drain Current, VGS @ 10V (Silicon Limited)

Continuous Drain Current, V_GS@ 10V (Wire Bond Limited)

Pulsed Drain Current

I_D@ T_C= 100°C

I_D@ T_C= 25°C

I_DM

120

512

P_D@T_C= 25°C

230

Maximum Power Dissipation

1.5

Linear Derating Factor

W/°C

V_GS

± 20

Gate-to-Source Voltage

6.7

Peak Diode Recovery

dv/dt

T_J

V/ns

°C

-55 to + 175

Operating Junction and

T_STG

Storage Temperature Range

300

Soldering Temperature, for 10 seconds

(1.6mm from case)

10lbf in (1.1N m)

Mounting torque, 6-32 or M3 screw

Avalanche Characteristics

Single Pulse Avalanche Energy

E_{AS (Thermally limited)}

140

Avalanche Current

I_AR

See Fig. 14, 15, 22a, 22b

Repetitive Avalanche Energy

E_AR

Thermal Resistance

Symbol

Parameter

Typ.

–––

Max.

0.65

–––

Units

R_θJC

Junction-to-Case

R_θCS

R_θJA

0.50

–––

°C/W

Case-to-Sink, Flat Greased Surface , TO-220

Junction-to-Ambient, TO-220

Junction-to-Ambient (PCB Mount) , D²Pak

R_θ

www.irf.com

08/19/11

12 3 4 5 6 7...12

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