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IRFB3207ZPBF PDF预览

IRFB3207ZPBF

更新时间: 2024-11-27 03:08:07
品牌 Logo 应用领域
英飞凌 - INFINEON 晶体晶体管功率场效应晶体管开关脉冲局域网
页数 文件大小 规格书
11页 829K
描述
HEXFET Power MOSFET

IRFB3207ZPBF 技术参数

是否Rohs认证: 符合生命周期:Active
包装说明:LEAD FREE PACKAGE-3Reach Compliance Code:compliant
ECCN代码:EAR99风险等级:0.84
雪崩能效等级(Eas):170 mJ外壳连接:DRAIN
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:75 V
最大漏极电流 (Abs) (ID):170 A最大漏极电流 (ID):120 A
最大漏源导通电阻:0.0041 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JEDEC-95代码:TO-220ABJESD-30 代码:R-PSFM-T3
元件数量:1端子数量:3
工作模式:ENHANCEMENT MODE最高工作温度:175 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:FLANGE MOUNT峰值回流温度(摄氏度):NOT SPECIFIED
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):300 W
最大脉冲漏极电流 (IDM):670 A认证状态:Not Qualified
子类别:FET General Purpose Power表面贴装:NO
端子形式:THROUGH-HOLE端子位置:SINGLE
处于峰值回流温度下的最长时间:NOT SPECIFIED晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

IRFB3207ZPBF 数据手册

 浏览型号IRFB3207ZPBF的Datasheet PDF文件第2页浏览型号IRFB3207ZPBF的Datasheet PDF文件第3页浏览型号IRFB3207ZPBF的Datasheet PDF文件第4页浏览型号IRFB3207ZPBF的Datasheet PDF文件第5页浏览型号IRFB3207ZPBF的Datasheet PDF文件第6页浏览型号IRFB3207ZPBF的Datasheet PDF文件第7页 
PD - 97213  
IRFB3207ZPbF  
IRFS3207ZPbF  
IRFSL3207ZPbF  
Applications  
l High Efficiency Synchronous Rectification in  
SMPS  
HEXFET® Power MOSFET  
l Uninterruptible Power Supply  
l High Speed Power Switching  
l Hard Switched and High Frequency Circuits  
D
S
VDSS  
75V  
RDS(on) typ.  
3.3m  
4.1m  
:
:
G
max  
ID  
170A  
Benefits  
l Improved Gate, Avalanche and Dynamic  
dv/dt Ruggedness  
l Fully Characterized Capacitance and  
Avalanche SOA  
D
D
D
l Enhanced body diode dV/dt and dI/dt  
Capability  
S
S
S
D
D
G
G
G
D2Pak  
TO-262  
TO-220AB  
IRFB3207ZPbF  
IRFS3207ZPbF  
IRFSL3207ZPbF  
G
D
S
Gate  
Drain  
Source  
Absolute Maximum Ratings  
Symbol  
Parameter  
Continuous Drain Current, VGS @ 10V  
Continuous Drain Current, VGS @ 10V  
Pulsed Drain Current d  
Max.  
170c  
120c  
670  
Units  
A
ID @ TC = 25°C  
ID @ TC = 100°C  
IDM  
PD @TC = 25°C  
300  
W
Maximum Power Dissipation  
Linear Derating Factor  
2.0  
W/°C  
V
VGS  
± 20  
Gate-to-Source Voltage  
16  
Peak Diode Recovery f  
dv/dt  
TJ  
V/ns  
°C  
-55 to + 175  
Operating Junction and  
TSTG  
Storage Temperature Range  
Soldering Temperature, for 10 seconds  
(1.6mm from case)  
300  
10lbxin (1.1Nxm)  
Mounting torque, 6-32 or M3 screw  
Avalanche Characteristics  
Single Pulse Avalanche Energy e  
EAS (Thermally limited)  
180  
75  
mJ  
A
Avalanche Currentꢀc  
IAR  
Repetitive Avalanche Energy g  
EAR  
30  
mJ  
Thermal Resistance  
Symbol  
Parameter  
Typ.  
Max.  
0.50  
–––  
62  
Units  
RθJC  
–––  
0.50  
–––  
–––  
Junction-to-Case k  
RθCS  
RθJA  
RθJA  
°C/W  
Case-to-Sink, Flat Greased Surface , TO-220  
Junction-to-Ambient, TO-220 k  
Junction-to-Ambient (PCB Mount) , D2Pak jk  
40  
www.irf.com  
1
05/29/06  

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