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IRFAE30 PDF预览

IRFAE30

更新时间: 2024-10-31 22:05:23
品牌 Logo 应用领域
英飞凌 - INFINEON 晶体晶体管局域网
页数 文件大小 规格书
7页 149K
描述
REPETITIVE AVALANCHE AND dv/dt RATED HEXFET TRANSISTORS THRU-HOLE (TO-204AA/AE)

IRFAE30 技术参数

是否Rohs认证: 符合生命周期:Obsolete
包装说明:HERMETIC SEALED, TO-3, 2 PINReach Compliance Code:compliant
风险等级:5.72雪崩能效等级(Eas):100 mJ
外壳连接:DRAIN配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:800 V最大漏极电流 (ID):3.1 A
最大漏源导通电阻:3.7 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JEDEC-95代码:TO-204AAJESD-30 代码:O-MBFM-P2
元件数量:1端子数量:2
工作模式:ENHANCEMENT MODE封装主体材料:METAL
封装形状:ROUND封装形式:FLANGE MOUNT
峰值回流温度(摄氏度):260极性/信道类型:N-CHANNEL
最大脉冲漏极电流 (IDM):12 A认证状态:Not Qualified
表面贴装:NO端子形式:PIN/PEG
端子位置:BOTTOM处于峰值回流温度下的最长时间:40
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

IRFAE30 数据手册

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PD - 90614  
REPETITIVEAVALANCHEANDdv/dtRATED  
HEXFET TRANSISTORS  
IRFAE30  
800V, N-CHANNEL  
THRU-HOLE (TO-204AA/AE)  
Product Summary  
Part Number BVDSS RDS(on)  
IRFAE30 800V 3.2Ω  
ID  
3.1Α  
The HEXFET technology is the key to International  
Rectifier’s advanced line of power MOSFET transistors.  
The efficient geometry and unique processing of this latest  
“State of the Art” design achieves: very low on-state resis-  
tance combined with high transconductance; superior re-  
verse energy and diode recovery dv/dt capability.  
TO-3  
The HEXFET transistors also feature all of the well estab-  
lished advantages of MOSFETs such as voltage control,  
very fast switching, ease of paralleling and temperature  
stability of the electrical parameters.  
Features:  
n
n
n
n
n
Repetitive Avalanche Ratings  
Dynamic dv/dt Rating  
Hermetically Sealed  
Simple Drive Requirements  
Ease of Paralleling  
They are well suited for applications such as switching  
power supplies, motor controls, inverters, choppers, audio  
amplifiers and high energy pulse circuits.  
Absolute Maximum Ratings  
Parameter  
Units  
I
@ V  
@ V  
=0V, T = 25°C  
Continuous Drain Current  
Continuous Drain Current  
Pulsed Drain Current  
Max. Power Dissipation  
Linear Derating Factor  
3.1  
2.0  
D
GS  
C
A
I
D
= 0V, T = 100°C  
C
GS  
I
12  
DM  
@ T = 25°C  
P
75  
W
W/°C  
V
D
C
0.6  
V
GS  
Gate-to-Source Voltage  
±20  
E
Single Pulse Avalanche Energy ➀  
Avalanche Current ➀  
100  
3.1  
mJ  
AS  
I
A
AR  
E
Repetitive Avalanche Energy ➀  
Peak Diode Recovery dv/dt ➀  
Operating Junction  
7.5  
mJ  
AR  
dv/dt  
2.0  
V/ns  
T
-55 to 150  
J
T
Storage Temperature Range  
oC  
g
STG  
Lead Temperature  
Weight  
300 (0.063 in. (1.6mm) from case for 10s)  
11.5(typical)  
For footnotes refer to the last page  
www.irf.com  
1
01/24/01  

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