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IRF9Z24N PDF预览

IRF9Z24N

更新时间: 2024-10-03 17:15:11
品牌 Logo 应用领域
友台半导体 - UMW /
页数 文件大小 规格书
8页 544K
描述
种类:P-Channel;漏源电压(Vdss):-55V;持续漏极电流(Id)(在25°C时):-12A;Vgs(th)(V):±20;漏源导通电阻:175mΩ@-10V

IRF9Z24N 数据手册

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R
IRF9Z24  
-55V P-Channel MOSFET  
UUMWW  
D
Description  
The TO-220 package is universally preferred for all  
commercial-industrialapplicationsatpowerdissipation  
levels to approximately 50 watts. The low thermal  
resistance and low package cost of the TO-220  
contribute to its wide acceptance throughout the  
industry.  
G
S
Features  
VDS (V) =-55V  
ID = -12A (VGS = -10V)  
R
DS(ON) < 170m(VGS = -10V)  
Absolute Maximum Ratings  
Parameter  
Max.  
Units  
ID @ TC = 25°C  
ID @ TC = 100°C  
IDM  
Continuous Drain Current, VGS @ -10V  
Continuous Drain Current, VGS @ -10V  
Pulsed Drain Current   
-12  
-8.5  
-48  
A
PD @TC = 25°C  
Power Dissipation  
45  
W
W/°C  
V
Linear Derating Factor  
0.30  
± 20  
96  
VGS  
EAS  
IAR  
Gate-to-Source Voltage  
Single Pulse Avalanche Energy‚  
Avalanche Current  
mJ  
A
-7.2  
4.5  
EAR  
dv/dt  
TJ  
Repetitive Avalanche Energy  
Peak Diode Recovery dv/dt ƒ  
Operating Junction and  
mJ  
V/ns  
-5.0  
-55 to + 175  
TSTG  
Storage Temperature Range  
Soldering Temperature, for 10 seconds  
Mounting torque, 6-32 or M3 screw  
°C  
300 (1.6mm from case )  
10 lbf•in (1.1N•m)  
Thermal Resistance  
Parameter  
Typ.  
Max.  
Units  
RθJC  
RθCS  
RθJA  
Junction-to-Case  
3.3  
Case-to-Sink, Flat, Greased Surface  
Junction-to-Ambient  
0.50  
°C/W  
62  
www.umw-ic.com  
1
UTD Semiconductor Co.,Limited  
 

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