IRF9620S, SiHF9620S
www.vishay.com
Vishay Siliconix
Power MOSFET
FEATURES
S
• Surface-mount
D2PAK (TO-263)
• Available in tape and reel
• Dynamic dV/dt rating
• P-channel
Available
Available
G
• Fast switching
• Ease of paralleling
• Simple drive requirements
• Material categorization: for definitions of
D
G
compliance please see www.vishay.com/doc?99912
S
D
Note
*
This datasheet provides information about parts that are
RoHS-compliant and / or parts that are non RoHS-compliant. For
example, parts with lead (Pb) terminations are not RoHS-compliant.
Please see the information / tables in this datasheet for details
P-Channel MOSFET
PRODUCT SUMMARY
VDS (V)
DESCRIPTION
-200
The power MOSFETs technology is the key to Vishay’s
advanced line of Power MOSFET transistors. The efficient
geometry and unique processing of the Power MOSFETs
design achieve very low on-state resistance combined with
high transconductance and extreme device ruggedness.
R
DS(on) (Ω)
VGS = -10 V
1.5
Qg max. (nC)
22
12
10
Q
gs (nC)
gd (nC)
Q
The D2PAK (TO-263) is a surface-mount power package
capable of accommodating die sizes up to HEX-4. It
provides the highest power capability and the lowest
possible on-resistance in any existing surface-mount
package. The D2PAK (TO-263) is suitable for high current
applications because of its low internal connection
resistance and can dissipate up to 2.0 W in a typical surface
mount application.
Configuration
Single
ORDERING INFORMATION
Package
D2PAK (TO-263)
SiHF9620S-GE3
IRF9620SPbF
D2PAK (TO-263)
SiHF9620STRL-GE3 a
IRF9620STRLPbF a
Lead (Pb)-free and Halogen-free
Lead (Pb)-free
Note
a. See device orientation
ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted)
PARAMETER
SYMBOL
LIMIT
-200
20
UNIT
Drain-Source Voltage
Gate-Source Voltage
VDS
V
VGS
T
C = 25 °C
-3.5
Continuous Drain Current
VGS at -10 V
ID
TC = 100 °C
-2.0
A
Pulsed Drain Current a
IDM
-14
Linear Derating Factor
Linear Derating Factor (PCB mount) e
0.32
0.025
-14
W/°C
A
Inductive Current, Clamp
ILM
PD
Maximum Power Dissipation
T
C = 25 °C
40
W
Maximum Power Dissipation (PCB mount) e
Peak Diode Recovery dV/dt c
TA = 25 °C
3.0
dV/dt
-5.0
V/ns
°C
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak temperature) d
TJ, Tstg
-55 to +150
300
For 10 s
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 5)
b. Not Applicabl
c. ISD ≤ -3.5 A, dI/dt ≤ 95 A/μs, VDD ≤ VDS, TJ ≤ 150 °C
d. 1.6 mm from case
e. When mounted on 1” square PCB (FR-4 or G-10 material)
S21-0904-Rev. D, 30-Aug-2021
Document Number: 91083
1
For technical questions, contact: hvm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000