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IRF840ASTRL PDF预览

IRF840ASTRL

更新时间: 2024-11-29 05:39:27
品牌 Logo 应用领域
威世 - VISHAY /
页数 文件大小 规格书
8页 919K
描述
Power MOSFET

IRF840ASTRL 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
包装说明:SMALL OUTLINE, R-PSSO-G2针数:3
Reach Compliance Code:unknown风险等级:5.01
雪崩能效等级(Eas):510 mJ外壳连接:DRAIN
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:500 V
最大漏极电流 (Abs) (ID):8 A最大漏极电流 (ID):8 A
最大漏源导通电阻:0.85 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JESD-30 代码:R-PSSO-G2JESD-609代码:e0
元件数量:1端子数量:2
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):NOT SPECIFIED
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):3.1 W
最大脉冲漏极电流 (IDM):32 A认证状态:Not Qualified
子类别:FET General Purpose Power表面贴装:YES
端子面层:TIN LEAD端子形式:GULL WING
端子位置:SINGLE处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

IRF840ASTRL 数据手册

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IRF840AS, IRF840AL, SiHF840AS, SiHF840AL  
Vishay Siliconix  
Power MOSFET  
FEATURES  
• Low Gate Charge Qg Results in Simple Drive  
Requirement  
PRODUCT SUMMARY  
VDS (V)  
500  
Available  
R
DS(on) (Ω)  
VGS = 10 V  
0.85  
• Improved Gate, Avalanche and Dynamic dV/dt RoHS*  
Qg (Max.) (nC)  
38  
COMPLIANT  
Ruggedness  
9.0  
Q
Q
gs (nC)  
gd (nC)  
• Fully  
Characterized  
Capacitance  
and  
18  
Avalanche Voltage and Current  
Configuration  
Single  
• Effective Coss Specified  
D
• Lead (Pb)-free Available  
D2PAK  
(TO-263)  
I2PAK  
(TO-262)  
APPLICATIONS  
• Switch Mode Power Supply (SMPS)  
• Uninterruptible Power Supply  
• High Speed Power Switching  
G
G
D
TYPICAL SMPS TOPOLOGIES  
S
• Two Transistor Forward  
• Half Bridge  
S
N-Channel MOSFET  
• Full Bridge  
ORDERING INFORMATION  
Package  
D2PAK (TO-263)  
D2PAK (TO-263)  
D2PAK (TO-263)  
IRF840ASTRRPbFa  
SiHF840ASTR-E3a  
IRF840ASTRRa  
SiHF840ASTRa  
I2PAK (TO-262)  
IRF840ALPbF  
SiHF840AL-E3  
IRF840AL  
IRF840ASPbF  
SiHF840AS-E3  
IRF840AS  
IRF840ASTRLPbFa  
SiHF840ASTL-E3a  
IRF840ASTRLa  
Lead (Pb)-free  
SnPb  
SiHF840AS  
SiHF840ASTLa  
SiHF840AL  
Note  
a. See device orientation.  
ABSOLUTE MAXIMUM RATINGS TC = 25 °C, unless otherwise noted  
PARAMETER  
SYMBOL  
LIMIT  
UNIT  
Drain-Source Voltage  
Gate-Source Voltage  
VDS  
500  
30  
V
VGS  
TC = 25 °C  
TC =100°C  
8.0  
Continuous Drain Current  
V
GS at 10 V  
ID  
5.1  
A
Pulsed Drain Currenta  
IDM  
32  
Linear Derating Factor  
1.0  
W/°C  
mJ  
A
Single Pulse Avalanche Energyb  
Repetitive Avalanche Currenta  
Repetitive Avalanche Energya  
EAS  
IAR  
510  
8.0  
EAR  
13  
mJ  
T
C = 25 °C  
125  
Maximum Power Dissipation  
PD  
W
V/ns  
°C  
TA = 25 °C  
3.1  
Peak Diode Recovery dV/dtc, e  
dV/dt  
5.0  
Operating Junction and Storage Temperature Range  
Soldering Temperature  
TJ, Tstg  
- 55 to + 150  
300d  
for 10 s  
Notes  
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).  
b. Starting TJ = 25 °C, L = 16 mH, RG = 25 Ω, IAS = 8.0 A (see fig. 12).  
c. ISD 8.0 A, dI/dt 100 A/µs, VDD VDS, TJ 150 °C.  
d. 1.6 mm from case.  
e. Uses IRF840A/SiH840A data and test conditions.  
* Pb containing terminations are not RoHS compliant, exemptions may apply  
Document Number: 91066  
S-81412-Rev. A, 07-Jul-08  
www.vishay.com  
1

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