IRF820S, SiHF820S, IRF820L, SiHF820L
www.vishay.com
Vishay Siliconix
Power MOSFET
FEATURES
PRODUCT SUMMARY
• Surface mount
• Available in tape and reel
• Dynamic dV/dt rating
• Repetitive avalanche rated
• Fast switching
• Ease of paralleling
• Simple drive requirements
VDS (V)
DS(on) ()
Qg (Max.) (nC)
500
R
VGS = 10 V
3.0
Available
24
3.3
Q
gs (nC)
gd (nC)
Available
Q
13
Configuration
Single
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
D
D2PAK (TO-263)
I2PAK (TO-262)
Note
*
This datasheet provides information about parts that are
RoHS-compliant and / or parts that are non-RoHS-compliant. For
example, parts with lead (Pb) terminations are not RoHS-compliant.
Please see the information / tables in this datasheet for details.
G
G
D
S
DESCRIPTION
D
S
G
Third generation power MOSFETs from Vishay provide the
designer with the best combination of fast switching,
ruggedized device design, low on-resistance and
cost-effectiveness.
S
The D2PAK (TO-263) is a surface mount power package
capable of accommodating die size up to HEX-4. It provides
the highest power capability and the lowest possible
on-resistance in any existing surface mount package. The
D2PAK (TO-263) is suitable for high current applications
because of its low internal connection resistance and can
dissipate up to 2.0 W in a typical surface mount application.
N-Channel MOSFET
ORDERING INFORMATION
Package
D2PAK (TO-263)
SiHF820S-GE3
IRF820SPbF
D2PAK (TO-263)
SiHF820STRL-GE3 a
IRF820STRLPbF a
D2PAK (TO-263)
SiHF820STRR-GE3 a
IRF820STRRPbF a
I2PAK (TO-262)
SiHF820L-GE3
IRF820LPbF
Lead (Pb)-free and halogen-free
Lead (Pb)-free
Note
a. See device orientation.
ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted)
PARAMETER
SYMBOL
LIMIT
500
UNIT
Drain-Source Voltage
Gate-Source Voltage
VDS
VGS
V
20
T
C = 25 °C
2.5
Continuous Drain Current
VGS at 10 V
ID
TC = 100 °C
1.6
A
Pulsed Drain Current a
IDM
8.0
Linear Derating Factor
0.40
0.025
210
W/°C
Linear Derating Factor (PCB mount) e
Single Pulse Avalanche Energy b
Avalanche Current a
EAS
IAR
mJ
A
2.5
Repetitive Avalanche Energy a
EAR
5.0
mJ
Maximum Power Dissipation
T
C = 25 °C
50
PD
W
V/ns
°C
Maximum Power Dissipation (PCB mount) e
Peak Diode Recovery dV/dt c
TA = 25 °C
3.1
dV/dt
3.5
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak temperature) d
TJ, Tstg
-55 to +150
300
for 10 s
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).
b. VDD = 50 V, starting TJ = 25 °C, L = 60 mH, Rg = 25 , IAS = 2.5 A (see fig. 12).
c. ISD 2.5 A, dI/dt 50 A/μs, VDD VDS, TJ 150 °C.
d. 1.6 mm from case.
e. When mounted on 1" square PCB (FR-4 or G-10 material).
S15-1659-Rev. D, 20-Jul-15
Document Number: 91060
1
For technical questions, contact: hvm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000