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IRF820S, SiHF820S, IRF820L, SiHF820L PDF预览

IRF820S, SiHF820S, IRF820L, SiHF820L

更新时间: 2024-11-24 14:57:11
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威世 - VISHAY /
页数 文件大小 规格书
10页 232K
描述
Power MOSFET

IRF820S, SiHF820S, IRF820L, SiHF820L 数据手册

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IRF820S, SiHF820S, IRF820L, SiHF820L  
www.vishay.com  
Vishay Siliconix  
Power MOSFET  
FEATURES  
PRODUCT SUMMARY  
• Surface mount  
• Available in tape and reel  
• Dynamic dV/dt rating  
• Repetitive avalanche rated  
• Fast switching  
• Ease of paralleling  
• Simple drive requirements  
VDS (V)  
DS(on) ()  
Qg (Max.) (nC)  
500  
R
VGS = 10 V  
3.0  
Available  
24  
3.3  
Q
gs (nC)  
gd (nC)  
Available  
Q
13  
Configuration  
Single  
• Material categorization: for definitions of compliance  
please see www.vishay.com/doc?99912  
D
D2PAK (TO-263)  
I2PAK (TO-262)  
Note  
*
This datasheet provides information about parts that are  
RoHS-compliant and / or parts that are non-RoHS-compliant. For  
example, parts with lead (Pb) terminations are not RoHS-compliant.  
Please see the information / tables in this datasheet for details.  
G
G
D
S
DESCRIPTION  
D
S
G
Third generation power MOSFETs from Vishay provide the  
designer with the best combination of fast switching,  
ruggedized device design, low on-resistance and  
cost-effectiveness.  
S
The D2PAK (TO-263) is a surface mount power package  
capable of accommodating die size up to HEX-4. It provides  
the highest power capability and the lowest possible  
on-resistance in any existing surface mount package. The  
D2PAK (TO-263) is suitable for high current applications  
because of its low internal connection resistance and can  
dissipate up to 2.0 W in a typical surface mount application.  
N-Channel MOSFET  
ORDERING INFORMATION  
Package  
D2PAK (TO-263)  
SiHF820S-GE3  
IRF820SPbF  
D2PAK (TO-263)  
SiHF820STRL-GE3 a  
IRF820STRLPbF a  
D2PAK (TO-263)  
SiHF820STRR-GE3 a  
IRF820STRRPbF a  
I2PAK (TO-262)  
SiHF820L-GE3  
IRF820LPbF  
Lead (Pb)-free and halogen-free  
Lead (Pb)-free  
Note  
a. See device orientation.  
ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted)  
PARAMETER  
SYMBOL  
LIMIT  
500  
UNIT  
Drain-Source Voltage  
Gate-Source Voltage  
VDS  
VGS  
V
20  
T
C = 25 °C  
2.5  
Continuous Drain Current  
VGS at 10 V  
ID  
TC = 100 °C  
1.6  
A
Pulsed Drain Current a  
IDM  
8.0  
Linear Derating Factor  
0.40  
0.025  
210  
W/°C  
Linear Derating Factor (PCB mount) e  
Single Pulse Avalanche Energy b  
Avalanche Current a  
EAS  
IAR  
mJ  
A
2.5  
Repetitive Avalanche Energy a  
EAR  
5.0  
mJ  
Maximum Power Dissipation  
T
C = 25 °C  
50  
PD  
W
V/ns  
°C  
Maximum Power Dissipation (PCB mount) e  
Peak Diode Recovery dV/dt c  
TA = 25 °C  
3.1  
dV/dt  
3.5  
Operating Junction and Storage Temperature Range  
Soldering Recommendations (Peak temperature) d  
TJ, Tstg  
-55 to +150  
300  
for 10 s  
Notes  
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).  
b. VDD = 50 V, starting TJ = 25 °C, L = 60 mH, Rg = 25 , IAS = 2.5 A (see fig. 12).  
c. ISD 2.5 A, dI/dt 50 A/μs, VDD VDS, TJ 150 °C.  
d. 1.6 mm from case.  
e. When mounted on 1" square PCB (FR-4 or G-10 material).  
S15-1659-Rev. D, 20-Jul-15  
Document Number: 91060  
1
For technical questions, contact: hvm@vishay.com  
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  

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