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IRF730S, SiHF730S PDF预览

IRF730S, SiHF730S

更新时间: 2024-11-19 14:55:23
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威世 - VISHAY /
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9页 187K
描述
Power MOSFET

IRF730S, SiHF730S 数据手册

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IRF730S, SiHF730S  
www.vishay.com  
Vishay Siliconix  
Power MOSFET  
FEATURES  
D
• Surface-mount  
• Available in tape and reel  
• Dynamic dV/dt rating  
SMD-220  
Available  
Available  
• Repetitive avalanche rated  
• Fast switching  
G
• Ease of paralleling  
• Simple drive requirements  
• Material categorization: for definitions of compliance  
please see www.vishay.com/doc?99912  
S
D
G
S
N-Channel MOSFET  
Note  
*
This datasheet provides information about parts that are  
RoHS-compliant and / or parts that are non RoHS-compliant. For  
example, parts with lead (Pb) terminations are not RoHS-compliant.  
Please see the information / tables in this datasheet for details  
PRODUCT SUMMARY  
VDS (V)  
400  
DESCRIPTION  
RDS(on) (Ω)  
VGS = 10 V  
1.0  
Third generation power MOSFETs from Vishay provide the  
designer with the best combination of fast switching,  
ruggedized device design, low on-resistance and  
cost-effectiveness.  
Qg max. (nC)  
38  
5.7  
Qgs (nC)  
gd (nC)  
Q
22  
The D2PAK (TO-263) is a surface-mount power package  
capable of accommodating die size up to HEX-4. It provides  
the highest power capability and the lowest possible  
on-resistance in any existing surface mount package. The  
D2PAK (TO-263) is suitable for high current applications  
because of its low internal connection resistance and can  
dissipate up to 2.0 W in a typical surface mount application.  
Configuration  
Single  
ORDERING INFORMATION  
Package  
D2PAK (TO-263)  
SiHF730S-GE3  
IRF730SPbF  
D2PAK (TO-263)  
SiHF730STRL-GE3 a  
IRF730STRLPbF a  
D2PAK (TO-263)  
SiHF730STRR-GE3 a  
Lead (Pb)-free and Halogen-free  
Lead (Pb)-free  
IRF730STRRPbF  
Note  
a. See device orientation  
ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted)  
PARAMETER  
SYMBOL  
LIMIT  
UNIT  
Drain-Source Voltage  
Gate-Source Voltage  
VDS  
400  
20  
V
VGS  
T
C = 25 °C  
5.5  
Continuous Drain Current  
VGS at 10 V  
ID  
TC = 100 °C  
3.5  
A
Pulsed Drain Current a  
IDM  
22  
Linear Derating Factor  
0.59  
0.025  
290  
W/°C  
Linear Derating Factor (PCB mount) e  
Single Pulse Avalanche Energy b  
Avalanche Current a  
EAS  
IAR  
mJ  
A
5.5  
Repetitive Avalanche Energy a  
EAR  
7.4  
mJ  
Maximum Power Dissipation  
Maximum Power Dissipation (PCB mount) e  
Peak Diode Recovery dV/dt c  
T
C = 25 °C  
74  
PD  
W
V/ns  
°C  
TA = 25 °C  
3.1  
dV/dt  
4.0  
Operating Junction and Storage Temperature Range  
Soldering Recommendations (Peak temperature) d  
TJ, Tstg  
-55 to +150  
300  
For 10 s  
Notes  
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11)  
b. VDD = 50 V, starting TJ = 25 °C, L = 16 mH, Rg = 25 Ω, IAS = 5.5 A (see fig. 12)  
c. ISD 5.5 A, dI/dt 90 A/μs, VDD VDS, TJ 150 °C  
d. 1.6 mm from case  
e. When mounted on 1" square PCB (FR-4 or G-10 material)  
S21-0901-Rev. D, 30-Aug-2021  
Document Number: 91048  
1
For technical questions, contact: hvm@vishay.com  
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  

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