IRF730S, SiHF730S
www.vishay.com
Vishay Siliconix
Power MOSFET
FEATURES
D
• Surface-mount
• Available in tape and reel
• Dynamic dV/dt rating
SMD-220
Available
Available
K
• Repetitive avalanche rated
• Fast switching
G
• Ease of paralleling
• Simple drive requirements
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
S
D
G
S
N-Channel MOSFET
Note
*
This datasheet provides information about parts that are
RoHS-compliant and / or parts that are non RoHS-compliant. For
example, parts with lead (Pb) terminations are not RoHS-compliant.
Please see the information / tables in this datasheet for details
PRODUCT SUMMARY
VDS (V)
400
DESCRIPTION
RDS(on) (Ω)
VGS = 10 V
1.0
Third generation power MOSFETs from Vishay provide the
designer with the best combination of fast switching,
ruggedized device design, low on-resistance and
cost-effectiveness.
Qg max. (nC)
38
5.7
Qgs (nC)
gd (nC)
Q
22
The D2PAK (TO-263) is a surface-mount power package
capable of accommodating die size up to HEX-4. It provides
the highest power capability and the lowest possible
on-resistance in any existing surface mount package. The
D2PAK (TO-263) is suitable for high current applications
because of its low internal connection resistance and can
dissipate up to 2.0 W in a typical surface mount application.
Configuration
Single
ORDERING INFORMATION
Package
D2PAK (TO-263)
SiHF730S-GE3
IRF730SPbF
D2PAK (TO-263)
SiHF730STRL-GE3 a
IRF730STRLPbF a
D2PAK (TO-263)
SiHF730STRR-GE3 a
Lead (Pb)-free and Halogen-free
Lead (Pb)-free
IRF730STRRPbF
Note
a. See device orientation
ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted)
PARAMETER
SYMBOL
LIMIT
UNIT
Drain-Source Voltage
Gate-Source Voltage
VDS
400
20
V
VGS
T
C = 25 °C
5.5
Continuous Drain Current
VGS at 10 V
ID
TC = 100 °C
3.5
A
Pulsed Drain Current a
IDM
22
Linear Derating Factor
0.59
0.025
290
W/°C
Linear Derating Factor (PCB mount) e
Single Pulse Avalanche Energy b
Avalanche Current a
EAS
IAR
mJ
A
5.5
Repetitive Avalanche Energy a
EAR
7.4
mJ
Maximum Power Dissipation
Maximum Power Dissipation (PCB mount) e
Peak Diode Recovery dV/dt c
T
C = 25 °C
74
PD
W
V/ns
°C
TA = 25 °C
3.1
dV/dt
4.0
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak temperature) d
TJ, Tstg
-55 to +150
300
For 10 s
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11)
b. VDD = 50 V, starting TJ = 25 °C, L = 16 mH, Rg = 25 Ω, IAS = 5.5 A (see fig. 12)
c. ISD ≤ 5.5 A, dI/dt ≤ 90 A/μs, VDD ≤ VDS, TJ ≤ 150 °C
d. 1.6 mm from case
e. When mounted on 1" square PCB (FR-4 or G-10 material)
S21-0901-Rev. D, 30-Aug-2021
Document Number: 91048
1
For technical questions, contact: hvm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000