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IRF7103TR PDF预览

IRF7103TR

更新时间: 2024-05-23 22:22:19
品牌 Logo 应用领域
友台半导体 - UMW /
页数 文件大小 规格书
8页 406K
描述
种类:N+N-Channel;漏源电压(Vdss):50V;持续漏极电流(Id)(在25°C时):3A;Vgs(th)(V):±20;漏源导通电阻:13mΩ@10V

IRF7103TR 数据手册

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R
UMW  
IRF7103  
Channel MOSFET  
Dual N  
Features  
VDS (V)=50V  
l
l
l
l
l
l
30m (VGS = 10V)  
40 m (VGS = 4.5V)  
RDS(ON)  
RDS(ON)  
1
2
8
7
S1  
G1  
D1  
Adavanced Process Technology  
Ultra Low On-Resistance  
Surface Mount  
D1  
3
4
6
5
S2  
G2  
D2  
D2  
l
l
l
Dynamic dv/dt Rating  
Fast Switching  
Lead-Free  
Top View  
Description  
The SOP-8 has been modified through a  
customized leadframe for enhanced thermal  
characteristics and dual-die capability making  
it ideal in a variety of power applications.With  
these improvements, multiple devices can be  
used in an application with dramatically  
reduced board space. The package is  
designed for vapor phase, infra red. or wave  
soldering technigues Power dissipation of  
greater than 0.8W is possible in a typical pcB  
mount application.  
Absolute Maximum Ratings  
Parameter  
Max.  
3.0  
Units  
ID @ TA = 25°C  
ID @ TA = 70°C  
IDM  
Continuous Drain Current, VGS @ 10V  
Continuous Drain Current, VGS @ 10V  
Pulsed Drain Current   
A
2.3  
10  
PD @TA = 25°C  
Power Dissipation  
2.0  
W
W/°C  
V
Linear Derating Factor  
0.016  
± 20  
VGS  
Gate-to-Source Voltage  
dv/dt  
TJ,TSTG  
Peak Diode Recovery dv/dt ‚  
Junction and Storage Temperature Range  
4.5  
V/nS  
-55 to + 150  
°C  
Thermal Resistance Ratings  
Parameter  
Min.  
Typ.  
Max.  
Units  
RθJA  
Maximum Junction-to-Ambient „  
62.5  
°C/W  
www.umw-ic.com  
1
UTD Semiconductor Co.,Limited  

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