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IRF530STRLPBF PDF预览

IRF530STRLPBF

更新时间: 2024-09-15 11:09:19
品牌 Logo 应用领域
威世 - VISHAY 晶体晶体管功率场效应晶体管开关脉冲
页数 文件大小 规格书
9页 176K
描述
Power MOSFET

IRF530STRLPBF 技术参数

是否无铅:不含铅是否Rohs认证:符合
生命周期:Active包装说明:SMALL OUTLINE, R-PSSO-G2
针数:3Reach Compliance Code:unknown
ECCN代码:EAR99Factory Lead Time:6 weeks
风险等级:5Is Samacsys:N
雪崩能效等级(Eas):69 mJ外壳连接:DRAIN
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:100 V
最大漏极电流 (Abs) (ID):14 A最大漏极电流 (ID):14 A
最大漏源导通电阻:0.16 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JESD-30 代码:R-PSSO-G2JESD-609代码:e3
湿度敏感等级:1元件数量:1
端子数量:2工作模式:ENHANCEMENT MODE
最高工作温度:175 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):260极性/信道类型:N-CHANNEL
最大功率耗散 (Abs):88 W最大脉冲漏极电流 (IDM):56 A
认证状态:Not Qualified子类别:FET General Purpose Powers
表面贴装:YES端子面层:Matte Tin (Sn)
端子形式:GULL WING端子位置:SINGLE
处于峰值回流温度下的最长时间:40晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

IRF530STRLPBF 数据手册

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IRF530S, SiHF530S  
Vishay Siliconix  
Power MOSFET  
FEATURES  
PRODUCT SUMMARY  
VDS (V)  
Halogen-free According to IEC 61249-2-21  
Definition  
• Surface Mount  
• Available in Tape and Reel  
• Dynamic dV/dt Rating  
• Repetitive Avalanche Rated  
• 175 °C Operating Temperature  
• Fast Switching  
100  
RDS(on) ()  
VGS = 10 V  
0.16  
Qg (Max.) (nC)  
Qgs (nC)  
26  
5.5  
Q
gd (nC)  
11  
Configuration  
Single  
• Ease of Paralleling  
• Compliant to RoHS Directive 2002/95/EC  
D
DESCRIPTION  
D2PAK (TO-263)  
Third generation Power MOSFETs from Vishay provide the  
designer with the best combination of fast switching,  
ruggedized device design, low on-resistance and  
cost-effectiveness.  
G
The D2PAK (TO-263) is a surface mount power package  
capable of accommodating die size up to HEX-4. It provides  
the highest power capability and the lowest possible  
on-resistance in any existing surface mount package. The  
D2PAK (TO-263) is suitable for high current applications  
because of its low internal connection resistance and can  
dissipate up to 2.0 W in a typical surface mount application.  
D
G
S
S
N-Channel MOSFET  
ORDERING INFORMATION  
Package  
D2PAK (TO-263)  
D2PAK (TO-263)  
SiHF530STRL-GE3a  
IRF530STRLPbFa  
SiHF530STL-E3a  
D2PAK (TO-263)  
SiHF530STRR-GE3a  
IRF530STRRPbFa  
SiHF530STR-E3a  
Lead (Pb)-free and Halogen-free SiHF530S-GE3  
IRF530SPbF  
Lead (Pb)-free  
SiHF530S-E3  
Note  
a. See device orientation.  
ABSOLUTE MAXIMUM RATINGS TC = 25 °C, unless otherwise noted  
PARAMETER  
SYMBOL  
LIMIT  
UNIT  
Drain-Source Voltage  
Gate-Source Voltage  
100  
VDS  
VGS  
V
20  
14  
TC = 25 °C  
Continuous Drain Current  
VGS at 10 V  
ID  
10  
56  
A
TC = 100 °C  
Pulsed Drain Currenta  
IDM  
Linear Derating Factor  
0.59  
0.025  
69  
W/°C  
Linear Derating Factor (PCB Mount)e  
Single Pulse Avalanche Energyb  
Avalanche Currenta  
mJ  
A
EAS  
IAR  
14  
Repetitive Avalanche Energya  
8.8  
mJ  
EAR  
Maximum Power Dissipation  
Maximum Power Dissipation (PCB Mount)e  
Peak Diode Recovery dV/dtc  
88  
TC = 25 °C  
PD  
W
V/ns  
°C  
3.7  
TA = 25 °C  
dV/dt  
5.5  
Operating Junction and Storage Temperature Range  
Soldering Recommendations (Peak Temperature)  
- 55 to + 175  
300d  
TJ, Tstg  
for 10 s  
Notes  
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).  
b. VDD = 25 V, starting TJ = 25 °C, L = 528 μH, Rg = 25 , IAS = 14 A (see fig. 12).  
c. ISD 14 A, dI/dt 140 A/μs, VDD VDS, TJ 175 °C.  
d. 1.6 mm from case.  
e. When mounted on 1" square PCB (FR-4 or G-10 material).  
* Pb containing terminations are not RoHS compliant, exemptions may apply  
Document Number: 91020  
S11-1046-Rev. C, 30-May-11  
www.vishay.com  
1
This document is subject to change without notice.  
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  

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