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IRF1324LPBF PDF预览

IRF1324LPBF

更新时间: 2024-11-12 05:39:27
品牌 Logo 应用领域
英飞凌 - INFINEON /
页数 文件大小 规格书
10页 522K
描述
HEXFET Power MOSFET

IRF1324LPBF 数据手册

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PD - 97353A  
IRF1324SPbF  
IRF1324LPbF  
HEXFET® Power MOSFET  
Applications  
l High Efficiency Synchronous Rectification in SMPS  
l Uninterruptible Power Supply  
l High Speed Power Switching  
D
S
VDSS  
RDS(on) typ.  
24V  
1.3m  
1.65m  
max.  
l Hard Switched and High Frequency Circuits  
G
ID  
ID  
340A  
(Silicon Limited)  
195A  
(Package Limited)  
Benefits  
l Improved Gate, Avalanche and Dynamic dV/dt  
Ruggedness  
l Fully Characterized Capacitance and Avalanche  
SOA  
l Enhanced body diode dV/dt and dI/dt Capability  
l Lead-Free  
S
S
D
D
G
G
D2Pak  
IRF1324SPbF  
TO-262  
IRF1324LPbF  
G
D
S
Gate  
Drain  
Source  
Absolute Maximum Ratings  
Symbol  
ID @ TC = 25°C  
ID @ TC = 100°C  
ID @ TC = 25°C  
IDM  
Parameter  
Max.  
340  
Units  
Continuous Drain Current, VGS @ 10V (Silicon Limited)  
Continuous Drain Current, VGS @ 10V (Silicon Limited)  
Continuous Drain Current, VGS @ 10V (Wire Bond Limited)  
Pulsed Drain Current  
240  
A
195  
1420  
300  
PD @TC = 25°C  
Maximum Power Dissipation  
W
W/°C  
V
2.0  
Linear Derating Factor  
VGS  
dv/dt  
TJ  
± 20  
0.46  
Gate-to-Source Voltage  
Peak Diode Recovery  
V/ns  
-55 to + 175  
Operating Junction and  
TSTG  
Storage Temperature Range  
°C  
300  
Soldering Temperature, for 10 seconds  
(1.6mm from case)  
Avalanche Characteristics  
EAS (Thermally limited)  
270  
Single Pulse Avalanche Energy  
Avalanche Current  
mJ  
A
IAR  
See Fig. 14, 15, 22a, 22b  
EAR  
Repetitive Avalanche Energy  
mJ  
Thermal Resistance  
Symbol  
Parameter  
Typ.  
–––  
Max.  
0.50  
40  
Units  
°C/W  
Rθ  
JC  
Junction-to-Case  
Rθ  
JA  
Junction-to-Ambient (PCB Mounted, steady-state)  
–––  
www.irf.com  
1
09/24/09  

IRF1324LPBF 替代型号

型号 品牌 替代类型 描述 数据表
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