Data Sheet No. PD65008
IR2117C/IR2118C
SINGLE CHANNEL DRIVER DIE IN WAFER FORM
Features
Floating channel designed for bootstrap operation
Fully operational to +600V
•
Tolerant to negative transient voltage - dV/dt immune
Gate drive supply range from 10 to 20V
•
•
•
•
Undervoltage lockout
CMOS Schmitt-triggered inputs with pull-down
Output in phase with input IR2117C or out of phase with input IR2118C
Description
The IR2117/IR2118(S) is a high voltage, high speed power MOSFET and IGBT driver. Proprietary HVIC and
latch immune CMOS technologies enable ruggedized monolithic construction. The logic input is compatible with
standard CMOS outputs. The output driver features a high pulse current buffer stage designed for minimum
cross-conduction. The floating channel can be used to drive an N-channel power MOSFET or IGBT in the high or
low side configuration which operates up to 600 volts.
Typical Connection
ꢉꢊꢋꢌꢍꢋꢋꢎꢏꢏꢀ
IR2117
ꢀ
ꢁꢁ
ꢀ
ꢁꢁ
ꢀ
ꢂ
ꢆꢇ
ꢆꢇ
ꢄꢅ
ꢐꢅ
ꢑꢅꢒꢓ
ꢁꢅꢈ
ꢀ
ꢃ
ꢉꢊꢋꢌꢍꢋꢎꢏꢏꢀ
ꢀ
ꢁꢁ
ꢀ
ꢁꢁ
ꢀ
ꢂ
IR2118
ꢆꢇ
ꢆꢇ
ꢁꢅꢈ
ꢄꢅ
ꢐꢅ
ꢑꢅꢒꢓ
ꢀ
ꢃ
(Refer to Lead Assignments for correct pin configuration).
This/These diagram(s) show electrical connections only.
Please refer to our Application Notes and DesignTips for
proper circuit board layout.
Note:
! This IR product is100% tested at wafer level and is manufactured using established, mature and well characterized processes.
Due to restrictions in die level processing, die may not be equivalent to standard package products and are therefore offered with
a conditional performance guarantee. The above data sheet is based on IR sample testing under certain predetermined and
assumed conditions, and are provided for illustration purposes only. Customers are encouraged to perform testing in actual
proposed packaged and use conditions. IR die products are tested using IR-based quality assurance procedures and are
manufactured using IR’s established processes. Programs for customer-specified testing are available upon request. IR has
experienced assembly yields of generally 95% or greater for individual die; however, customer’s results will vary. Estimates such
as those described and set forth in this data sheet for semiconductor die will vary depending on a number of packaging, handling,
use and other factors. Sold die may not perform on an equivalent basis to standard package products and are therefore offered
with a limited warranty as described in IR’s applicable standard terms and conditions of sale. All IR die sales are subject to IR’s
applicablestandardtermsandconditionsofsale,whichareavailableuponrequest.Forcustomersrequiringaparticularparameter
to be guaranteed, special testing can be carried out or product can be purchased as known good die.
" Part number shown is for die in wafer. Contact factory for these other options.
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