IQEXO-3
ISSUE 5; 1 1 OCTOBER 2004
Delivery Options
Marking
■
Model num ber
■
Com m on frequencies are available from stock
■
Frequency
Output Com patibility
Minim um Order Inform ation Required
■
HCMOS
■
Frequency + Model Num ber
Package Outline
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8-pin DIL com patible plastic encapsulated
Frequency Stability
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±100ppm
Operating Tem perature Range
■
–10 to 70°C
Outline in m m
Storage Tem perature Range
■
–55 to 125°C
Mechanical Specification
1
■
■
■
■
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Mechanical Shock: 1000g,
0.35m s in three directions
/ sine wave im pulse for
2
7.62
1.52
2.54
0.5
Resistance to Soldering Heat: Leads dipped in soldering
bath @ 260°C for 10 secs
Resistance to Solvent: Dipping in fluoric solvent for 90
secs
0.6
0.45
8
1
7
2
6
3
5
4
0 to 15
Solderability: 90% of soldered surface m asked with new
solder after dipping in solder bath @ 230°C for 3 secs
Vibration: 10 to 55Hz 1.5m m displacem ent, 50 to 2000Hz
20g acceleration, 1 hour in each of three m utually
perpendicular planes
12.8
Handling & Operational Precautions
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Observe anti-static handling precautions
Frequency Program m ing
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A decoupling capacitor of <0.01µF should be connected
between Pin 8 and Ground
Input
Output
Select
Pin 3
ST
Pin 1
Fundamental
Oscillation
Pin 2
Divided
Frequency
Term inal Connections
Pin 7
C
Pin 6
B
Pin 5
A
■
1: Crystal frequency output (fo)
2: Divided frequency output (fo/2n)
■
L
L
L
L
L
H
L
H
H
H
H
H
H
H
H
fo
fo
fo
fo
fo
fo
fo
fo
fo÷2
fo÷4
■
3: Standby term inal; Logic ‘1’ to pin 3 enables oscillator
output; logic ‘0’ to pin 3 disables oscillator output;
when disabled the oscillator output goes to the high
im pedance state
L
H
H
L
fo÷8
L
H
L
fo÷16
fo÷32
fo÷64
fo÷128
fo÷256
H
H
H
H
■
4: GND
L
H
L
■
5: Program s division ratio
H
H
■
6: Program s division ratio
H
■
7: Program s division ratio
■
8: Power supply voltage