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IPDD60R190G7 PDF预览

IPDD60R190G7

更新时间: 2024-11-19 14:56:15
品牌 Logo 应用领域
英飞凌 - INFINEON 开关PC服务器电信高压功率因数校正
页数 文件大小 规格书
14页 978K
描述
英飞凌现创新推出双 DPAK (DDPAK),这是首款顶部冷却 SMD 封装,主要面向大功率 SMPS 应用,如 PC 电源、太阳能、服务器和电信设备等应用。现有高压技术的优点?600V CoolMOS? G7 超级结 (SJ) MOSFET结合了顶部冷却的创新概念,为 PFC 等高电流硬开关拓扑提供了系统解决方案,为 LLC 拓扑提供了高端高效解决方案。

IPDD60R190G7 数据手册

 浏览型号IPDD60R190G7的Datasheet PDF文件第2页浏览型号IPDD60R190G7的Datasheet PDF文件第3页浏览型号IPDD60R190G7的Datasheet PDF文件第4页浏览型号IPDD60R190G7的Datasheet PDF文件第5页浏览型号IPDD60R190G7的Datasheet PDF文件第6页浏览型号IPDD60R190G7的Datasheet PDF文件第7页 
IPDD60R190G7  
MOSFET  
PG-HDSOP-10-1  
600VꢀCoolMOS™ꢀG7ꢀSJꢀPowerꢀDevice  
TheꢀC7ꢀGOLDꢀseriesꢀ(G7)ꢀforꢀtheꢀfirstꢀtimeꢀbringsꢀtogetherꢀtheꢀbenefitsꢀof  
theꢀC7ꢀGOLDꢀCoolMOS™ꢀtechnology,ꢀ4ꢀpinꢀKelvinꢀSourceꢀcapabilityꢀand  
theꢀimprovedꢀthermalꢀpropertiesꢀofꢀtheꢀDDPAKꢀpackageꢀtoꢀenableꢀa  
possibleꢀꢀSMDꢀsolutionꢀforꢀhighꢀcurrentꢀtopologiesꢀsuchꢀasꢀPFCꢀupꢀtoꢀ3kW.  
10  
6
tab  
Pin 1  
5
Features  
•ꢀC7ꢀGoldꢀgivesꢀbestꢀinꢀclassꢀFOMꢀRDS(on)*EossꢀandꢀRDS(on)*Qg.  
•ꢀSuitableꢀforꢀhardꢀandꢀsoftꢀswitchingꢀ(PFCꢀandꢀhighꢀperformanceꢀLLC)  
•ꢀC7ꢀGoldꢀtechnologyꢀenablesꢀbestꢀinꢀclassꢀRDS(on)ꢀinꢀsmallestꢀfootprint.  
•ꢀDDPAKꢀpackageꢀhasꢀinbuiltꢀ4thꢀpinꢀKelvinꢀSourceꢀconfigurationꢀandꢀlow  
parasiticꢀsourceꢀinductanceꢀ(~3nH).  
•ꢀDDPAKꢀpackageꢀisꢀMSL1ꢀcompliant,ꢀtotalꢀPb-freeꢀandꢀhasꢀeasyꢀvisual  
inspectionꢀleads.  
Drain  
Pin 6-10, Tab  
•ꢀDDPAKꢀSMDꢀpackageꢀcombinedꢀwithꢀleadꢀfreeꢀdieꢀattachꢀprocess  
enablesꢀimprovedꢀthermalꢀperformanceꢀ(Rth).  
*1  
Gate  
Pin 1  
Driver  
Source  
Pin 2  
Power  
Source  
Pin 3,4,5  
Benefits  
•ꢀC7ꢀGoldꢀFOMꢀRDS(on)*Qgꢀꢀisꢀ15%ꢀbetterꢀthanꢀpreviousꢀC7ꢀ600Vꢀenabling  
fasterꢀswitchingꢀleadingꢀtoꢀhigherꢀefficiency.  
*1: Internal body diode  
•ꢀPossibilityꢀtoꢀincreasseꢀeconomiesꢀofꢀscalesꢀbyꢀusageꢀinꢀPFCꢀandꢀPWM  
topologiesꢀinꢀtheꢀapplication.  
•ꢀC7ꢀGoldꢀcanꢀreachꢀ50mꢀinꢀDDPAKꢀ115mm2ꢀfootprint,ꢀwhereasꢀprevious  
BICꢀC7ꢀ600Vꢀwasꢀ40mꢀinꢀ150mm2ꢀD2PAKꢀfootprint.  
•ꢀReducingꢀparasiticꢀsourceꢀinductanceꢀbyꢀKelvinꢀSourceꢀimproves  
efficiencyꢀbyꢀfasterꢀswitchingꢀandꢀeaseꢀofꢀuseꢀdueꢀtoꢀlessꢀringing.  
•ꢀDDPAKꢀpackageꢀisꢀeasyꢀtoꢀuseꢀandꢀhasꢀtheꢀhighestꢀqualityꢀstandards.  
•ꢀImprovedꢀthermalsꢀenableꢀSMDꢀDDPAKꢀpackageꢀtoꢀbeꢀusedꢀinꢀhigher  
currentꢀdesignsꢀthanꢀhasꢀbeenꢀpreviouslyꢀpossible.  
Potentialꢀapplications  
PFCꢀstagesꢀandꢀPWMꢀstagesꢀ(TTF,ꢀLLC)ꢀforꢀhighꢀpower/performance  
SMPSꢀe.g.ꢀComputing,ꢀServer,ꢀTelecom,ꢀUPSꢀandꢀSolar.  
Productꢀvalidation  
FullyꢀqualifiedꢀaccordingꢀtoꢀJEDECꢀforꢀIndustrialꢀApplications  
Pleaseꢀnote:ꢀForꢀMOSFETꢀparallelingꢀtheꢀuseꢀofꢀferriteꢀbeadsꢀonꢀtheꢀgate  
orꢀseparateꢀtotemꢀpolesꢀisꢀgenerallyꢀrecommended.  
Tableꢀ1ꢀꢀꢀꢀꢀKeyꢀPerformanceꢀParameters  
Parameter  
VDS@Tj,max  
RDS(on),max  
Qg,typ  
Value  
650  
190  
18  
Unit  
V
mΩ  
nC  
A
ID,pulse  
36  
ID,continuous @ Tj<150°C 19  
A
Eoss@400V  
2.17  
680  
µJ  
Body diode di/dt  
A/µs  
Typeꢀ/ꢀOrderingꢀCode  
Package  
Marking  
RelatedꢀLinks  
IPDD60R190G7  
PG-HDSOP-10  
60R190G7  
see Appendix A  
Final Data Sheet  
1
Rev.ꢀ2.1,ꢀꢀ2020-10-27  

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