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IPDD60R150G7 PDF预览

IPDD60R150G7

更新时间: 2024-11-10 11:11:51
品牌 Logo 应用领域
英飞凌 - INFINEON 开关PC服务器电信高压功率因数校正
页数 文件大小 规格书
14页 987K
描述
英飞凌现创新推出双 DPAK (DDPAK),这是首款顶部冷却 SMD 封装,主要面向大功率 SMPS 应用,如 PC 电源、太阳能、服务器和电信设备等应用。现有高压技术的优点 600V CoolMOS™ G7 超级结 (SJ) MOSFET结合了顶部冷却的创新概念,为 PFC 等高电流硬开关拓扑提供了系统解决方案,为 LLC 拓扑提供了高端高效解决方案。

IPDD60R150G7 数据手册

 浏览型号IPDD60R150G7的Datasheet PDF文件第2页浏览型号IPDD60R150G7的Datasheet PDF文件第3页浏览型号IPDD60R150G7的Datasheet PDF文件第4页浏览型号IPDD60R150G7的Datasheet PDF文件第5页浏览型号IPDD60R150G7的Datasheet PDF文件第6页浏览型号IPDD60R150G7的Datasheet PDF文件第7页 
IPDD60R150G7  
MOSFET  
PG-HDSOP-10-1  
600VꢀCoolMOS™ꢀG7ꢀSJꢀPowerꢀDevice  
TheꢀC7ꢀGOLDꢀseriesꢀ(G7)ꢀforꢀtheꢀfirstꢀtimeꢀbringsꢀtogetherꢀtheꢀbenefitsꢀof  
theꢀC7ꢀGOLDꢀCoolMOS™ꢀtechnology,ꢀ4ꢀpinꢀKelvinꢀSourceꢀcapabilityꢀand  
theꢀimprovedꢀthermalꢀpropertiesꢀofꢀtheꢀDDPAKꢀpackageꢀtoꢀenableꢀa  
possibleꢀꢀSMDꢀsolutionꢀforꢀhighꢀcurrentꢀtopologiesꢀsuchꢀasꢀPFCꢀupꢀtoꢀ3kW.  
10  
6
tab  
Pin 1  
5
Features  
•ꢀC7ꢀGoldꢀgivesꢀbestꢀinꢀclassꢀFOMꢀRDS(on)*EossꢀandꢀRDS(on)*Qg.  
•ꢀSuitableꢀforꢀhardꢀandꢀsoftꢀswitchingꢀ(PFCꢀandꢀhighꢀperformanceꢀLLC)  
•ꢀC7ꢀGoldꢀtechnologyꢀenablesꢀbestꢀinꢀclassꢀRDS(on)ꢀinꢀsmallestꢀfootprint.  
•ꢀDDPAKꢀpackageꢀhasꢀinbuiltꢀ4thꢀpinꢀKelvinꢀSourceꢀconfigurationꢀandꢀlow  
parasiticꢀsourceꢀinductanceꢀ(~3nH).  
•ꢀDDPAKꢀpackageꢀisꢀMSL1ꢀcompliant,ꢀtotalꢀPb-freeꢀandꢀhasꢀeasyꢀvisual  
inspectionꢀleads.  
Drain  
Pin 6-10, Tab  
•ꢀDDPAKꢀSMDꢀpackageꢀcombinedꢀwithꢀleadꢀfreeꢀdieꢀattachꢀprocess  
enablesꢀimprovedꢀthermalꢀperformanceꢀ(Rth).  
*1  
Gate  
Pin 1  
Driver  
Source  
Pin 2  
Power  
Source  
Pin 3,4,5  
Benefits  
•ꢀC7ꢀGoldꢀFOMꢀRDS(on)*Qgꢀꢀisꢀ15%ꢀbetterꢀthanꢀpreviousꢀC7ꢀ600Vꢀenabling  
fasterꢀswitchingꢀleadingꢀtoꢀhigherꢀefficiency.  
*1: Internal body diode  
•ꢀPossibilityꢀtoꢀincreasseꢀeconomiesꢀofꢀscalesꢀbyꢀusageꢀinꢀPFCꢀandꢀPWM  
topologiesꢀinꢀtheꢀapplication.  
•ꢀC7ꢀGoldꢀcanꢀreachꢀ50mꢀinꢀDDPAKꢀ115mm2ꢀfootprint,ꢀwhereasꢀprevious  
BICꢀC7ꢀ600Vꢀwasꢀ40mꢀinꢀ150mm2ꢀD2PAKꢀfootprint.  
•ꢀReducingꢀparasiticꢀsourceꢀinductanceꢀbyꢀKelvinꢀSourceꢀimproves  
efficiencyꢀbyꢀfasterꢀswitchingꢀandꢀeaseꢀofꢀuseꢀdueꢀtoꢀlessꢀringing.  
•ꢀDDPAKꢀpackageꢀisꢀeasyꢀtoꢀuseꢀandꢀhasꢀtheꢀhighestꢀqualityꢀstandards.  
•ꢀImprovedꢀthermalsꢀenableꢀSMDꢀDDPAKꢀpackageꢀtoꢀbeꢀusedꢀinꢀhigher  
currentꢀdesignsꢀthanꢀhasꢀbeenꢀpreviouslyꢀpossible.  
Potentialꢀapplications  
PFCꢀstagesꢀandꢀPWMꢀstagesꢀ(TTF,ꢀLLC)ꢀforꢀhighꢀpower/performance  
SMPSꢀe.g.ꢀComputing,ꢀServer,ꢀTelecom,ꢀUPSꢀandꢀSolar.  
Productꢀvalidation  
FullyꢀqualifiedꢀaccordingꢀtoꢀJEDECꢀforꢀIndustrialꢀApplications  
Pleaseꢀnote:ꢀForꢀMOSFETꢀparallelingꢀtheꢀuseꢀofꢀferriteꢀbeadsꢀonꢀtheꢀgate  
orꢀseparateꢀtotemꢀpolesꢀisꢀgenerallyꢀrecommended.  
Tableꢀ1ꢀꢀꢀꢀꢀKeyꢀPerformanceꢀParameters  
Parameter  
VDS@Tj,max  
RDS(on),max  
Qg,typ  
Value  
650  
150  
23  
Unit  
V
mΩ  
nC  
A
ID,pulse  
45  
ID,continuous @ Tj<150°C 23  
A
Eoss@400V  
2.74  
700  
µJ  
Body diode di/dt  
A/µs  
Typeꢀ/ꢀOrderingꢀCode  
Package  
Marking  
RelatedꢀLinks  
IPDD60R150G7  
PG-HDSOP-10  
60R150G7  
see Appendix A  
Final Data Sheet  
1
Rev.ꢀ2.1,ꢀꢀ2020-10-27  

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