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IPC302N25N3 PDF预览

IPC302N25N3

更新时间: 2024-11-19 14:56:19
品牌 Logo 应用领域
英飞凌 - INFINEON 以太网转换器
页数 文件大小 规格书
3页 108K
描述
英飞凌凭借? OptiMOS? 200V 和 250V 产品,不断提供具有独特性能的同类中较为出色的导通电阻 (R?DS(on)) 功率 MOSFET。领先的导通电阻 R?DS(on) 和品质因数 (FOM) 特征可降低功耗,提高整体效率并提高功率密度。200V 和 250V 产品系列针对 110V AC 网络照明、HID 灯、直流-直流转换器和有源以太网 (PoE) 等应用进行了优化。

IPC302N25N3 数据手册

 浏览型号IPC302N25N3的Datasheet PDF文件第2页浏览型号IPC302N25N3的Datasheet PDF文件第3页 
IPC302N25N3  
OptiMOSTM3 Power MOS Transistor Chip  
Type  
V(BR)DSS  
RDS(on)  
Die size  
Thickness  
IPC302N25N3  
250 V  
20 m1)  
6.7 * 4.5 mm2  
250 m  
DESCRIPTION  
N-channel enhancement mode  
For additional characteristic and max rating refer to the datasheet of IPP200N25N3 G  
AQL 0.65 for visual inspection according to failure catalogue  
Electrostatic Discharge Sensitive Device according to MIL-STD 883C  
Die bond: soldered or glued  
Backside metallization: NiV system  
Frontside metallization: AlCu system  
Passivation: nitride (only on edge structure)  
Package: sawn on foil  
Electrical Characteristics on Wafer Level  
at Tj = 25 C, unless otherwise specified.  
Parameter  
Symbol Value  
min. typ.  
Unit Conditions  
max.  
Drain-source breakdown voltage V(BR)DSS 250  
-
-
V
V
VGS = 0V  
ID = 1 mA  
Gate threshold voltage  
VGS(th)  
2
-
3
4
1
VDS = VGS  
ID = 270 A  
Zero gate voltage drain current  
Gate-source leakage current  
Drain-source on-resistance  
IDSS  
0.1  
1
A VGS = 0V  
VDS = 200 V  
IGSS  
-
100 nA VGS = 20 V  
VDS = 0 V  
RDS(on)  
-
16 3) 100 2) mVGS= 10 V  
ID= 2 A  
Reverse diode forward on-voltage VSD  
-
0.7  
1.2  
-
V
VGS=0 V  
IF= 1 A  
Avalanche energy, single pulse  
EAS  
-
40 4)  
mJ ID= 30 A, RGS=25Ω  
1) packaged in a PG-TO220-3 (see ref. product)  
2) limited by wafer test-equipment  
3) typical bare die RDS(on); VGS=10V  
4) Wafer tested. For general avalanche capability refer to the datasheet of IPP200N25N3 G  
Infineon Technologies, Rev. 2.0 27.04.2010  

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