Datasheet > 28F128J3D75

28F128J3D75

更新时间： 2022-07-16 14:05:20

品牌	Logo	应用领域
英特尔 - INTEL		/
页数	文件大小	规格书
72页	1071K
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28F128J3D75 数据手册

Intel® Embedded Flash Memory (J3 v. D)

(32, 64, and 128 Mbit)

Datasheet

Product Features

■ Architecture

■ Security

—Enhanced security options for code

—High-density symmetrical 128-Kbyte

blocks

protection

—128 Mbit (128 blocks)

—64 Mbit (64 blocks)

—32 Mbit (32 blocks)

—128-bit Protection Register

—64-bit Unique device identifier

—64-bit User-programmable OTP cells

■ Performance

—Absolute protection with V_PEN= GND

—Individual block locking

—Block erase/program lockout during

—75 ns Initial Access Speed (128/64/32

-Mbit densities)

power transitions

—25 ns 8-word and 4-word

Asynchronous page-mode reads

—32-Byte Write buffer

—4 μs per Byte Effective

programming time

■ Software

—Program and erase suspend support

—Flash Data Integrator (FDI), Common

Flash Interface (CFI) Compatible

■ System Voltage and Power

—V_CC= 2.7 V to 3.6 V

■ Quality and Reliability

—Operating temperature:

-40 °C to +85 °C

—V_CCQ= 2.7 V to 3.6 V

—100K Minimum erase cycles per block

—0.13 μm ETOX™ VIII Process

■ Packaging

—56-Lead TSOP package

—64-Ball Intel Easy BGA package

The Intel® Embedded Flash Memory J3 Version D (J3 v. D) provides improved mainstream performance

with enhanced security features, taking advantage of the high quality and reliability of the NOR-based Intel

0.13 μm ETOX™ VIII process technology. Offered in 128-Mbit (16-Mbyte), 64-Mbit, and 32-Mbit

densities, the J3 v. D device brings reliable, low-voltage capability (3 V read, program, and erase) with high

speed, low-power operation.

The J3 v. D device takes advantage of the proven manufacturing experience and is ideal for code and data

applications where high density and low cost are required, such as in networking, telecommunications,

digital set top boxes, audio recording, and digital imaging.

Intel Flash Memory components also deliver a new generation of forward-compatible software support. By

using the Common Flash Interface (CFI) and Scalable Command Set (SCS), customers can take advantage

of density upgrades and optimized write capabilities of future Intel® Flash Memory devices.

Notice: This document contains information on new products in production. The specifications

are subject to change without notice. Verify with your local Intel sales office that you have the

latest datasheet before finalizing a design.

308551- 003

Feburary 2006

12 3 4 5 6 7...72

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