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INA-32063-TR2 PDF预览

INA-32063-TR2

更新时间: 2024-11-25 03:55:07
品牌 Logo 应用领域
安捷伦 - AGILENT 放大器射频微波
页数 文件大小 规格书
11页 81K
描述
3.0 GHz Wideband Silicon RFIC Amplifier

INA-32063-TR2 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
包装说明:TSSOP6,.08Reach Compliance Code:unknown
风险等级:5.1特性阻抗:50 Ω
构造:COMPONENT增益:15.5 dB
最大输入功率 (CW):7 dBmJESD-609代码:e0
安装特点:SURFACE MOUNT端子数量:6
最大工作频率:3000 MHz最小工作频率:100 MHz
最高工作温度:85 °C最低工作温度:-40 °C
封装主体材料:PLASTIC/EPOXY封装等效代码:TSSOP6,.08
电源:3 V射频/微波设备类型:WIDE BAND LOW POWER
子类别:RF/Microwave Amplifiers最大压摆率:25 mA
表面贴装:YES技术:BIPOLAR
端子面层:Tin/Lead (Sn/Pb)最大电压驻波比:1.6
Base Number Matches:1

INA-32063-TR2 数据手册

 浏览型号INA-32063-TR2的Datasheet PDF文件第2页浏览型号INA-32063-TR2的Datasheet PDF文件第3页浏览型号INA-32063-TR2的Datasheet PDF文件第4页浏览型号INA-32063-TR2的Datasheet PDF文件第5页浏览型号INA-32063-TR2的Datasheet PDF文件第6页浏览型号INA-32063-TR2的Datasheet PDF文件第7页 
3.0 GHz Wideband Silicon  
RFIC Amplifier  
Technical Data  
INA-32063  
Features  
Surface Mount SOT-363  
( SC-70) Package  
Description  
• 17 dB Gain at 1.9 GHz  
Agilents INA-32063 is a Silicon  
RFIC amplifier that offers  
excellent gain and output power  
for applications to 3.0 GHz.  
Packaged in an ultraminiature  
SOT-363 package, it requires half  
of the board space of a SOT-143  
package.  
• +3 dBm P1 dB at 1.9 GHz  
• Single +3V Supply  
• Unconditionally Stable  
Applications  
• LO Buffer and Driver  
Amplifier for Cellular,  
Cordless, Special Mobile  
Radio, PCS, ISM, Wireless  
LAN, DBS, TVRO, and TV  
Tuner  
Pin Connections and  
Package Marking  
The INA-32063 offers wide  
bandwidth and good linearity and  
17 dB gain with a modest supply  
current. With its input and output  
matched internally to 50 , the  
INA-32063 is a simple to use gain  
block that is suitable for  
GND 2 1  
GND 1 2  
INPUT 3  
6
OUTPUT  
& V  
d
5 GND 1  
4 V  
d
numerous applications.  
Note: Package marking provides  
orientation and identification.  
The INA-32063 is fabricated using  
Agilents 30 GHzfmax,  
ISOSAT™ Silicon-bipolar process  
that uses nitride, self-alignment,  
submicrometer lithography,  
trench isolation, ion implantation,  
and polyimide intermetal dielec-  
tric and scratch protection to  
achieve superior performance,  
uniformity and reliability.  
Simplified Schematic  
V
d
Output & V  
d
Input  
Gnd1  
Gnd2  

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