IMBG120R045M1H
IMBG120R045M1H
CoolSiC™ 1200V SiC Trench MOSFET
with .XT interconnection technology
Features
Very low switching losses
Drain
TAB
Short circuit withstand time 3 µs
Fully controllable dV/dt
Gate
pin 1
Benchmark gate threshold voltage, VGS(th) = 4.5V
Robust against parasitic turn on, 0V turn-off gate voltage can be applied
Robust body diode for hard commutation
.XT interconnection technology for best-in-class thermal performance
Package creepage and clearance distance > 6.1mm
Sense pin for optimized switching performance
Sense
pin 2
Source
pin 3...7
Benefits
Efficiency improvement
Enabling higher frequency
Increased power density
Cooling effort reduction
Reduction of system complexity and cost
Potential applications
Drives
Infrastructure – Charger
Energy generation - Solar string inverter and solar optimizer
Industrial power supplies - Industrial UPS
Product validation
Qualified for industrial applications according to the relevant tests of JEDEC 47/20/22
Note:
the source and sense pins are not exchangeable, their exchange might lead to malfunction
Table 1
Type
Key Performance and Package Parameters
VDS
ID
RDS(on
Tvj = 25°C, ID = 16A, VGS = 18V
Tvj,max
Marking
Package
PG-TO263-7
TC = 25°C, Rth(j-c,max)
IMBG120R045M1H 1200V
47A
45mΩ
175°C
12M1H045
Final Datasheet
Please read the Important Notice and Warnings at the end of this document
page 1 of 17
2.2
2020-12-11
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