ILH200
HERMETIC PHOTOTRANSISTOR
DUAL CHANNEL OPTOCOUPLER
FEATURES
Dimensions in inches (mm)
• Operating Temperature Range, –55°C to +125°C
• Current Transfer Ratio Guaranteed from
–55°C to +100°C Ambient Temperature Range
• High Current Transfer Ratio at Low Input Current
• Isolation Test Voltage, 3000 VDC
.390±.005
(9.91±.13)
8
7
6
5
4
.300
(7.62)
typ.
.320
(8.13)
max.
Siemens
XXX XXXX
• Two Isolated Channels per Package
• Standard 8 Pin DIP Package
XXYY
.150
(3.81)
max.
DESCRIPTION
1
2
3
.020
(.51)
min.
.010±.002
(.25±.05)
The ILH200 is designed especially for hi-rel applica-
tions requiring optical isolation with high current trans-
1
8
7
Anode
Emitter
fer ratio and low saturation V . Each channel of the
CE
optocoupler consists of a light emitting diode and a
NPN silicon phototransistor mounted and coupled in
an 8 pin hermetically sealed DIP package. The low
input current makes the ILH200 well suited for direct
CMOS to LSTTL/TTL interfaces.
.018±.002
(.46±.05)
.125
(3.18)
min.
2
3
Cathode
Collector
Collector
.100 ±.010
(2.54±.25)
6
Cathode
4
5
Anode
Emitter
Maximum Ratings
Emitter (per channel)
Reverse Voltage ................................................................................6.0 V
Forward Current ..............................................................................60 mA
(1)
Peak Forward Current ......................................................................1 A
Power Dissipation...........................................................................75 mW
Derate Linearly from 25°C ......................................................0.75 mW/°C
Detector (per channel)
Collector-Emitter Voltage ...................................................................70 V
Emitter-Collector Voltage .....................................................................7 V
Continuous Collector Current..........................................................50 mA
Power Dissipation.........................................................................100 mW
Derate Linearly from 25°C ........................................................1.0 mW/°C
Package
(2 )
Input to Output Isolation Test Voltage ...................................3000 VDC
Storage Temperature Range ..........................................–65°C to +150°C
Operating Temperature Range.......................................–55°C to +125°C
Junction Temperature ......................................................................150°C
Soldering Time at 240°C, 1.6 mm from case ................................ 10 sec.
Power Dissipation.........................................................................350 mW
Derate Linearly from 25°C ........................................................3.5 mW/°C
Notes:
1. Values applies for P ≤1 ms, PRR≤300 pps.
W
2. Measured between pins 1,2,3 and 4 shorted together and pins 5,6,7 and 8
shorted together. T =25°C and duration=1 second, RH=45%.
A
5–1