Datasheet > 射频和微波 > 射频/微波分光器/合路器> ILC-3F-2.14G

ILC-3F-2.14G

更新时间： 2024-11-26 05:39:15

品牌	Logo	应用领域
MERRIMAC		射频和微波射频分光器射频合路器微波分光器微波合路器
页数	文件大小	规格书
5页	143K
描述
IN-LINE COUPLERS

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ILC-3F-2.14G 技术参数

是否无铅：	不含铅	是否Rohs认证：	符合
生命周期：	Transferred	Reach Compliance Code：	unknown
风险等级：	5.73	构造：	COMPONENT
最大输入功率 (CW)：	50 dBm	最大插入损耗：	0.35 dB
最大工作频率：	2240 MHz	最小工作频率：	2040 MHz
最高工作温度：	85 °C	最低工作温度：	-55 °C
射频/微波设备类型：	SPLITTER AND COMBINER	最大电压驻波比：	1.25
Base Number Matches：	1

ILC-3F-2.14G 数据手册

ILC-3F-2.14G

IN-LINE COUPLERS

REV: 002, 06/28/02

• 2.04 - 2.24 GHz

• LOW LOSS

• LOW VSWR

• HIGH ISOLATION

• SURFACE MOUNT

TECHNICAL DESCRIPTION / APPLICATION

MULTI-MIX^®F SERIES IN-LINE COUPLERS

The Multi-Mix^®ILC-F series provides a power divider and combiner function with low insertion loss,

high isolation, and high power handling in a small outline. The ILC series are composed of serial con-

nected multi-couplers with each coupler having a different nominal coupling value. Equal split loss is

maintained at all of the coupled ports, since the direct-path loss of previous couplers is added. Each of

the paths through a divider / combiner pair have equal insertion phase, but the individual port paths do

not. Accurate phase and amplitude balance make them ideal for applications involving power

amplifiers, signal distribution and processing.

ILC-F in-line couplers are fusion bonded multilayer stripline assemblies. The fusion bonding process

yields a homogeneous monolithic dielectric structure with reliability, ruggedness, and electrical

performance that is superior to conventional adhesive bonding techniques.

The ILC-F series is an easy to install SMD designed specifically for the full spectrum of wireless

applications. The high stability ceramic filled PTFE dielectrics utilized in these components are

compatible with common substrates such as FR-4, G-10, and polyamide. The wrap around ground

plane provides excellent EM shielding.

AVAILABLE ON

Additional benefits include:

TAPE & REEL

• Cost effective for commercial wireless applications

• Operating temperature range –55°C to +85°C.

• Can be integrated with other Multi-Mix^®components in a multi-function module

RELIABILITY

The product family has passed environmental screening including Thermal shock, Burn-in,

Acceleration, Vibration, Mechanical Shock, Moisture Resistance, Resistance to Solder Heat, and

Thermal Cycling Life Test (>1000 cycles).

THE MULTI-MIX^®PROCESS

Multi-Mix^®is a manufacturing process based on fluoropolymer composite substrates that are fusion

bonded together into a multilayer structure. The fusion bonding process yields a homogeneous

monolithic structure with superior performance at microwave and millimeter wave frequencies. The

bonded layers can contain embedded semiconductors, MMICs, etched resistors, circuit patterns, and

plated-through vias to form a SMD module that requires no additional packaging and is suitable for

automated assembly.

THE MULTI-MIX MICROTECHNOLOGY^®GROUP IS ISO-9001 REGISTERED

U.S. patent 6,099,677 and other patents pending.

Merrimac Industries / 41 Fairfield Place, West Caldwell, NJ 07006

Tel: 1.888.434.MMFM / Fax: 973.882.5990 / Email: MMFM@merrimacind.com / www.Multi-Mix.com

12 3 4 5

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