IIM-42652 Product Brief
High-performance 6-Axis SmartIndustrial™ Motion Tracking
MEMS Device for Industrial Applications
GENERAL DESCRIPTION
APPLICATIONS
The IIM-42652 is a 6-axis SmartIndustrial™
MotionTracking device that supports an extended
operating temperature range.
•
•
•
•
•
Navigation
Orientation measurement
Tilt sensing
Platform stabilization
Robotics
The IIM-42652 combines a 3-axis gyroscope, and a 3-
axis accelerometer in a small
2.5 mm x 3 mm x 0.91 mm (14-pin LGA) package. It
also features a 2K-byte FIFO that can lower the
traffic on the serial bus interface and reduce power
consumption by allowing the system processor to
burst read sensor data and then go into a low-power
mode.
FEATURES
•
Digital-output X-, Y-, and Z-axis angular rate
sensors (gyroscopes) with programmable full-
scale range of ±15.625, ±31.25, ±62.5, ±125,
±250, ±500, ±1000, and ±2000 degrees/sec
Digital-output X-, Y-, and Z-axis accelerometer
with programmable full-scale range of ±2g, ±4g,
±8g and ±16g
•
IIM-42652 supports highly accurate external clock
input to reduce system level sensitivity error, improve
orientation measurement from gyroscope data and
to reduce ODR sensitivity to temperature and device
to device variation.
•
•
•
•
User-programmable interrupts
I3CSM / I2C / SPI slave host interface
Digital-output temperature sensor
Small and thin package:
The host interface can be configured to support I3CSM
slave, I2C slave, or SPI slave modes. The I3CSM
interface supports speeds up to 12.5 MHz (data rates
up to 12.5 Mbps in SDR mode, 25 Mbps in DDR
mode), the I2C interface supports speeds up to 1 MHz,
and the SPI interface supports speeds up to 24 MHz.
2.5 mm x 3 mm x 0.91 mm (14-pin LGA)
20,000 g shock tolerant
MEMS structure hermetically sealed and bonded
at wafer level
MEMS structure hermetically sealed and bonded
at wafer level
•
•
•
•
RoHS and Green compliant
The device features an operating voltage range from
3.6V down to 1.71V.
TYPICAL OPERATING CIRCUIT
AP_CS
ORDERING INFORMATION
PART NUMBER
TEMPERATURE
PACKAGE
IIM-42652†
−40°C to +105°C
14-pin LGA
14
13
12
AP_SDO
RESV
RESV
11
1
2
†Denotes RoHS and Green-compliant package
10 RESV
ICM-42605
IIM-42652
INT2 / FSYNC
RESV
3
4
9
8
/ CLKIN
1.71 – 3.6VDC
INT1 / INT
VDD
5
6
7
C1, 0.1 µF
C2, 2.2 µF
1.71 – 3.6VDC
C3, 10 nF
Application Schematic (SPI Interface to Host)
InvenSense, Inc. reserves the right to change
specifications and information herein without
notice unless the product is in mass
production and the product brief has been
designated by InvenSense in writing as subject
to a specified Product / Process Change
Notification Method regulation.
InvenSense, a TDK Group Company
1745 Technology Drive, San Jose, CA 95110 U.S.A
Document Number: PB-000095
Revision: 1.0
Release Date: 01/04/2021
+1(408) 988–7339
invensense.tdk.com