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IHLP2525CZER2R2M11 PDF预览

IHLP2525CZER2R2M11

更新时间： 2024-11-29 12:46:27
品牌 Logo 应用领域
威世 - VISHAY 电感器固定电感器测试大电流电感器
页数 文件大小 规格书
3页 119K
描述
Low Profile, High Current IHLP® Inductors

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中文翻译

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IHLP2525CZER2R2M11 技术参数

是否无铅：不含铅是否Rohs认证：符合
生命周期：Active包装说明：2525
Reach Compliance Code：unknownECCN代码：EAR99
HTS代码：8504.50.80.00风险等级：5.26
Is Samacsys：N大小写代码：2525
构造：Rectangular型芯材料：COMPOSITE
直流电阻：0.0165 Ω标称电感 (L)：2.2 µH
电感器应用：HIGH CURRENT INDUCTOR电感器类型：GENERAL PURPOSE INDUCTOR
JESD-609代码：e3功能数量：1
端子数量：2最高工作温度：125 °C
最低工作温度：-55 °C封装高度：3 mm
封装长度：6.47 mm封装形式：SMT
封装宽度：6.47 mm包装方法：TR, 13 Inch
最大额定电流：9 A形状/尺寸说明：RECTANGULAR PACKAGE
屏蔽：YES表面贴装：YES
端子面层：Matte Tin (Sn) - with Nickel (Ni) barrier端子位置：DUAL ENDED
端子形状：J BEND测试频率：0.1 MHz
容差：20%Base Number Matches：1

IHLP2525CZER2R2M11 数据手册

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IHLP-2525CZ-11  
Vishay Dale  
Low Profile, High Current IHLP® Inductors  
FEATURES  
• Shielded construction  
• Frequency range up to 1.0 MHz  
• Lowest DCR/μH, in this package size  
• Powered iron composition provides soft  
saturation  
• Handles high transient current spikes without hard  
saturation  
Manufactured under one or more of the following:  
US Patents; 6,198,375/6,204,744/6,449,829/6,460,244.  
Several foreign patents, and other patents pending.  
• Ultra low buzz noise, due to composite construction  
• Compliant to RoHS Directive 2002/95/EC  
• Halogen-free according to IEC 61249-2-21 definition  
STANDARD ELECTRICAL SPECIFICATIONS  
L0  
HEAT  
APPLICATIONS  
• PDA/notebook/desktop/server applications  
INDUCTANCE  
DCR DCR  
RATING SATURATION  
20 % AT 100 kHz, TYP. MAX. CURRENT  
0.25 V, 0 A  
(μH)  
CURRENT  
DC TYP.  
(A) (4)  
25 °C 25 °C DC TYP.  
• High current POL converters  
(m) (m)  
(A) (3)  
12.5  
9.0  
• Low profile, high current power supplies  
• Battery powered devices  
1.0  
2.2  
3.3  
4.7  
6.8  
8.2  
10  
7.6  
8.0  
9.5  
7.0  
6.5  
4.0  
4.0  
4.0  
3.5  
2.5  
15.7  
24.8  
31.8  
44.6  
52.3  
67.8  
16.5  
26.0  
33.4  
46.8  
54.9  
71.2  
• DC/DC converters in distributed power systems  
7.0  
• DC/DC converter for Field Programmable Gate Array  
(FPGA)  
6.0  
5.5  
5.0  
DIMENSIONS in inches [millimeters]  
4.0  
Typical Pad Layout (Min.)  
22  
128.9 135.0  
2.9  
0.255 0.010  
[6.47 0.254]  
0.125 0.01  
[3.18 0.3]  
0.135  
[3.43]  
Notes  
(1)  
(2)  
(3)  
(4)  
(5)  
All test data is referenced to 25 °C ambient  
Operating temperature range - 55 °C to + 125 °C  
0.146  
[3.71]  
0.290  
[7.37]  
DC current (A) that will cause an approximate T of 40 °C  
DC current (A) that will cause L0 to drop approximately 20 %  
The part temperature (ambient + temp. rise) should not exceed  
125 °C under worst case operating conditions. Circuit design,  
component placement, PWB trace size and thickness, airflow  
and other cooling provisions all affect the part temperature. Part  
temperature should be verified in the end application.  
0.270 0.015  
[6.86 0.381]  
0.118 [3.0] Max.  
0.050 0.012  
[1.27 0.30]  
DESCRIPTION  
IHLP-2525CZ-11  
1.0 μH  
20 %  
INDUCTANCE TOLERANCE  
ER  
PACKAGE CODE  
e3  
JEDEC LEAD (Pb)-FREE STANDARD  
MODEL  
INDUCTANCE VALUE  
GLOBAL PART NUMBER  
I
H
L
P
2
5
2
5
C
Z
E
R
1
R
0
M
1
1
PRODUCT FAMILY  
SIZE  
PACKAGE  
CODE  
INDUCTANCE  
VALUE  
TOL.  
SERIES  
Document Number: 34190  
Revision: 18-Mar-11  
For technical questions, contact: magnetics@vishay.com  
This datasheet is subject to change without notice.  
www.vishay.com  
1
THE PRODUCT DESCRIBED HEREIN AND THIS DATASHEET ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  
123

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