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IDT74FCT16952ETPV PDF预览

IDT74FCT16952ETPV

更新时间: 2024-11-28 23:11:47
品牌 Logo 应用领域
艾迪悌 - IDT 总线驱动器总线收发器触发器逻辑集成电路光电二极管输出元件
页数 文件大小 规格书
8页 78K
描述
16-BIT TRI-PORT BUS EXCHANGER

IDT74FCT16952ETPV 技术参数

是否Rohs认证:不符合生命周期:Obsolete
零件包装代码:SSOP包装说明:SSOP, SSOP56,.4
针数:56Reach Compliance Code:not_compliant
风险等级:5.19Is Samacsys:N
其他特性:WITH INDEPENDENT OUTPUT ENABLE FOR EACH DIRECTION控制类型:INDEPENDENT CONTROL
计数方向:BIDIRECTIONAL系列:FCT
JESD-30 代码:R-PDSO-G56JESD-609代码:e0
长度:18.415 mm负载电容(CL):50 pF
逻辑集成电路类型:REGISTERED BUS TRANSCEIVER最大I(ol):0.064 A
湿度敏感等级:1位数:8
功能数量:2端口数量:2
端子数量:56最高工作温度:85 °C
最低工作温度:-40 °C输出特性:3-STATE
输出极性:TRUE封装主体材料:PLASTIC/EPOXY
封装代码:SSOP封装等效代码:SSOP56,.4
封装形状:RECTANGULAR封装形式:SMALL OUTLINE, SHRINK PITCH
峰值回流温度(摄氏度):225电源:5 V
Prop。Delay @ Nom-Sup:3.7 ns传播延迟(tpd):3.7 ns
认证状态:Not Qualified座面最大高度:2.794 mm
子类别:Bus Driver/Transceivers最大供电电压 (Vsup):5.5 V
最小供电电压 (Vsup):4.5 V标称供电电压 (Vsup):5 V
表面贴装:YES技术:CMOS
温度等级:INDUSTRIAL端子面层:Tin/Lead (Sn85Pb15)
端子形式:GULL WING端子节距:0.635 mm
端子位置:DUAL处于峰值回流温度下的最长时间:20
翻译:N/A触发器类型:POSITIVE EDGE
宽度:7.5 mmBase Number Matches:1

IDT74FCT16952ETPV 数据手册

 浏览型号IDT74FCT16952ETPV的Datasheet PDF文件第2页浏览型号IDT74FCT16952ETPV的Datasheet PDF文件第3页浏览型号IDT74FCT16952ETPV的Datasheet PDF文件第4页浏览型号IDT74FCT16952ETPV的Datasheet PDF文件第5页浏览型号IDT74FCT16952ETPV的Datasheet PDF文件第6页浏览型号IDT74FCT16952ETPV的Datasheet PDF文件第7页 
IDT73720/A  
16-BIT TRI-PORT  
BUS EXCHANGER  
Integrated Device Technology, Inc.  
FEATURES:  
DESCRIPTION:  
• High-speed 16-bit bus exchange for interbus communica-  
tion in the following environments:  
— Multi-way interleaving memory  
— Multiplexed address and data busses  
• Direct interface to R3051 family RISChipSet  
— R3051 family of integrated RISController CPUs  
— R3721 DRAM controller  
The IDT73720/A Bus Exchanger is a high speed 16-bit bus  
exchange device intended for inter-bus communication in  
interleaved memory systems and high performance multi-  
plexed address and data busses.  
The Bus Exchanger is responsible for interfacing between  
the CPU A/D bus (CPU address/data bus) and multiple  
memory data busses.  
• Data path for read and write operations  
• Low noise 12mA TTL level outputs  
• Bidirectional 3-bus architecture: X, Y, Z  
— One CPU bus: X  
— Two (interleaved or banked) memory busses:Y & Z  
— Each bus can be independently latched  
• Byte control on all three busses  
The 73720/A uses a three bus architecture (X, Y, Z), with  
control signals suitable for simple transfer between the CPU  
bus (X) and either memory bus (Y or Z). The Bus Exchanger  
featuresindependentreadandwrite latchesforeachmemory  
bus, thus supporting a variety of memory strategies. All three  
ports support byte enable to independently enable upper and  
lower bytes.  
• Source terminated outputs for low noise and undershoot  
control  
• 68-pin PLCC and 80-pin PQFP package  
• High-performance CMOS technology.  
FUNCTIONAL BLOCK DIAGRAM  
OEYL  
8
Y0:7  
LEXY  
Y-WRITE  
LATCH  
16  
Y8:15  
8
(Even Path)  
8
8
OEYU  
LEYX  
Y-READ  
LATCH  
16  
8
8
16  
OEXL  
OEXU  
PATH  
8
OEXL  
OEYU  
OEYL  
OEZU  
OEZL  
X0:7  
M
U
X
T/R  
BUS CONTROL  
16  
OEU  
OEL  
X8:15  
8
OEXU  
8
16  
8
Z-READ  
LATCH  
LEZX  
16  
OEZL  
OEZU  
8
8
8
Z0:7  
16  
Z-WRITE  
LATCH  
16  
LEXZ  
Z8:15  
8
(Odd Path)  
2527 drw 01  
Figure 1. 73720 Block Diagram  
NOTE:  
1. Logic equations for bus control:  
OEXU = T/R* . OEU*; OEXL = T/R* . OEL*; OEYU = T/R . PATH . OEU*  
OEYL = T/R . PATH . OEL*; OEZU = T/R . PATH* . OEU*; OEZL = T/R . PATH* . OEL*  
RISChipSet, RISController, R305x, R3051, R3052 are trademarks and the IDT logo is a registered trademark of Integrated Device Technology, Inc.  
COMMERCIAL TEMPERATURE RANGE  
AUGUST 1995  
1995 Integrated Device Technology, Inc.  
11.5  
DSC-2046/6  
1

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