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IDT7203L30TDGB PDF预览

IDT7203L30TDGB

更新时间: 2024-11-07 10:04:39
品牌 Logo 应用领域
艾迪悌 - IDT 先进先出芯片
页数 文件大小 规格书
14页 305K
描述
FIFO, 2KX9, 30ns, Asynchronous, CMOS, CDIP28, GREEN, CERDIP-28

IDT7203L30TDGB 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Transferred零件包装代码:DIP
包装说明:DIP,针数:28
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8542.32.00.71风险等级:5.29
最长访问时间:30 ns周期时间:40 ns
JESD-30 代码:R-GDIP-T28JESD-609代码:e3
长度:37.1475 mm内存密度:18432 bit
内存宽度:9功能数量:1
端子数量:28字数:2048 words
字数代码:2000工作模式:ASYNCHRONOUS
最高工作温度:125 °C最低工作温度:-55 °C
组织:2KX9可输出:NO
封装主体材料:CERAMIC, GLASS-SEALED封装代码:DIP
封装形状:RECTANGULAR封装形式:IN-LINE
并行/串行:PARALLEL峰值回流温度(摄氏度):225
认证状态:Not Qualified筛选级别:MIL-STD-883 Class B
座面最大高度:5.08 mm最大供电电压 (Vsup):5.5 V
最小供电电压 (Vsup):4.5 V标称供电电压 (Vsup):5 V
表面贴装:NO技术:CMOS
温度等级:MILITARY端子面层:MATTE TIN
端子形式:THROUGH-HOLE端子节距:2.54 mm
端子位置:DUAL处于峰值回流温度下的最长时间:20
宽度:7.62 mm

IDT7203L30TDGB 数据手册

 浏览型号IDT7203L30TDGB的Datasheet PDF文件第2页浏览型号IDT7203L30TDGB的Datasheet PDF文件第3页浏览型号IDT7203L30TDGB的Datasheet PDF文件第4页浏览型号IDT7203L30TDGB的Datasheet PDF文件第5页浏览型号IDT7203L30TDGB的Datasheet PDF文件第6页浏览型号IDT7203L30TDGB的Datasheet PDF文件第7页 
IDT7203  
IDT7204  
IDT7205  
IDT7206  
IDT7207  
IDT7208  
CMOS ASYNCHRONOUS FIFO  
2,048 x 9, 4,096 x 9  
8,192 x 9, 16,384 x 9  
32,768 x 9 and 65,536 x 9  
Industrial temperature range (–40  
(plastic packages only)  
°C to +85°C) is available  
FEATURES:  
First-In/First-Out Dual-Port memory  
2,048 x 9 organization (IDT7203)  
Green parts available, see ordering information  
4,096 x 9 organization (IDT7204)  
8,192 x 9 organization (IDT7205)  
16,384 x 9 organization (IDT7206)  
32,768 x 9 organization (IDT7207)  
65,636 x 9 organization (IDT7208)  
High-speed: 12ns access time  
Low power consumption  
DESCRIPTION:  
TheIDT7203/7204/7205/7206/7207/7208aredual-portmemorybuffers  
withinternalpointersthatloadandemptydataonafirst-in/first-outbasis. The  
deviceusesFullandEmptyflagstopreventdataoverflowandunderflowand  
expansionlogictoallowforunlimitedexpansioncapabilityinbothwordsizeand  
depth.  
— Active: 660mW (max.)  
— Power-down: 44mW (max.)  
DataistoggledinandoutofthedevicethroughtheuseoftheWrite(W)and  
Read (R) pins.  
Asynchronous and simultaneous read and write  
Fully expandable in both word depth and width  
720x family is pin and functionally compatible from 256 x 9 to 64k x 9  
Status Flags: Empty, Half-Full, Full  
Retransmit capability  
High-performance CMOS technology  
Military product compliant to MIL-STD-883, Class B  
Standard Military Drawing for #5962-88669 (IDT7203), 5962-89567  
(IDT7203), and 5962-89568 (IDT7204) are listed on this function  
The device's 9-bit width provides a bit for a control or parity at the user’s  
option. ItalsofeaturesaRetransmit(RT)capabilitythatallowsthereadpointer  
to be reset to its initial position when RT is pulsed LOW. A Half-Full Flag is  
available in the single device and width expansion modes.  
These FIFOs are fabricated using high-speed CMOS technology. They  
aredesignedforapplicationsrequiringasynchronousandsimultaneousread/  
writesinmultiprocessing,ratebufferingandotherapplications.  
MilitarygradeproductismanufacturedincompliancewithMIL-STD-883,  
ClassB.  
FUNCTIONAL BLOCK DIAGRAM  
DATA INPUTS  
)
8
0
(D -D  
WRITE  
CONTROL  
W
RAM ARRAY  
2,048 x 9  
4,096 x 9  
8,192 x 9  
16,384 x 9  
32,768 x 9  
65,536 x 9  
WRITE  
POINTER  
READ  
POINTER  
THREE-  
STATE  
BUFFERS  
RS  
DATA OUTPUTS  
READ  
CONTROL  
)
8
(Q0-Q  
RESET  
LOGIC  
R
FLAG  
LOGIC  
EF  
FF  
FL/RT  
EXPANSION  
LOGIC  
XO/HF  
XI  
2661 drw01  
IDTandtheIDTlogoareregisteredtrademarksofIntegratedDeviceTechnology,Inc.  
COMMERCIAL,MILITARYANDINDUSTRIALTEMPERATURERANGES  
JUNE 2012  
1
© 2012 Integrated Device Technology, Inc. All rights reserved. Product subject to change without notice.  
DSC-2661/18  

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