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71V3557SA75BGI8 PDF预览

71V3557SA75BGI8

更新时间: 2024-01-22 07:22:26
品牌 Logo 应用领域
艾迪悌 - IDT 静态存储器
页数 文件大小 规格书
28页 511K
描述
ZBT SRAM, 128KX36, 7.5ns, CMOS, PBGA119, 14 X 22 MM, PLASTIC, BGA-119

71V3557SA75BGI8 技术参数

是否无铅: 含铅是否Rohs认证: 不符合
生命周期:Obsolete零件包装代码:QFP
包装说明:LQFP,针数:100
Reach Compliance Code:compliantECCN代码:3A991.B.2.A
HTS代码:8542.32.00.41风险等级:5.77
最长访问时间:8 ns其他特性:FLOW-THROUGH ARCHITECTURE
JESD-30 代码:R-PQFP-G100JESD-609代码:e0
长度:20 mm内存密度:4718592 bit
内存集成电路类型:ZBT SRAM内存宽度:18
湿度敏感等级:3功能数量:1
端子数量:100字数:262144 words
字数代码:256000工作模式:SYNCHRONOUS
最高工作温度:70 °C最低工作温度:
组织:256KX18封装主体材料:PLASTIC/EPOXY
封装代码:LQFP封装形状:RECTANGULAR
封装形式:FLATPACK, LOW PROFILE并行/串行:PARALLEL
峰值回流温度(摄氏度):240认证状态:Not Qualified
座面最大高度:1.6 mm最大供电电压 (Vsup):3.465 V
最小供电电压 (Vsup):3.135 V标称供电电压 (Vsup):3.3 V
表面贴装:YES技术:CMOS
温度等级:COMMERCIAL端子面层:TIN LEAD
端子形式:GULL WING端子节距:0.65 mm
端子位置:QUAD处于峰值回流温度下的最长时间:20
宽度:14 mmBase Number Matches:1

71V3557SA75BGI8 数据手册

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128K x 36, 256K x 18,  
IDT71V3557S  
IDT71V3559S  
IDT71V3557SA  
IDT71V3559SA  
3.3V Synchronous ZBT™ SRAMs  
3.3V I/O, Burst Counter,  
Flow-Through Outputs  
Features  
it read or write.  
128K x 36, 256K x 18 memory configurations  
Supports high performance system speed - 100 MHz  
(7.5 ns Clock-to-Data Access)  
The IDT71V3557/59 contain address, data-in and control signal  
registers.Theoutputsareflow-through(nooutputdataregister).Output  
enable is the only asynchronous signal and can be used to disable the  
outputsatanygiventime.  
A Clock Enable (CEN) pin allows operation of the IDT71V3557/59  
to be suspended as long as necessary. All synchronous inputs are  
ignored when (CEN) is high and the internal device registers will hold  
their previous values.  
Therearethreechipenablepins(CE1,CE2,CE2)thatallowtheuser  
todeselectthedevicewhendesired.Ifanyoneofthesethreeisnotasserted  
when ADV/LD is low, no new memory operation can be  
initiated. However, any pending data transfers (reads or writes) will  
be completed. The data bus will tri-state one cycle after chip is de-  
selectedorawriteisinitiated.  
The IDT71V3557/59 have an on-chip burst counter. In the burst  
mode, the IDT71V3557/59 can provide four cycles of data for a single  
address presented to the SRAM. The order of the burst sequence is  
defined by the LBO input pin. The LBO pin selects between linear and  
interleaved burst sequence. The ADV/LD signal is used to load a new  
externaladdress(ADV/LD=LOW)orincrementtheinternalburstcounter  
(ADV/LD = HIGH).  
ZBTTM Feature - No dead cycles between write and read  
cycles  
Internally synchronized output buffer enable eliminates  
the need to control OE  
Single R/W (READ/WRITE) control pin  
4-word burst capability (Interleaved or linear)  
Individual byte write (BW1 - BW4) control (May tie active)  
Three chip enables for simple depth expansion  
3.3V power supply (±5%), 3.3V (±5%) I/O Supply (VDDQ)  
Optional Boundary Scan JTAG Interface (IEEE 1149.1  
complaint)  
Packaged in a JEDEC Standard 100-pin plastic thin quad  
flatpack (TQFP), 119 ball grid array (BGA) and 165 fine  
pitch ball grid array (fBGA)  
Description  
TheIDT71V3557/59are3.3Vhigh-speed4,718,592-bit(4.5Mega-  
bit)synchronous SRAMs organizedas 128Kx36/256Kx18. Theyare  
designed to eliminate dead bus cycles when turning the bus around  
between reads and writes, or writes and reads. Thus they have been  
The IDT71V3557/59 SRAMs utilize IDT's latest high-performance  
CMOSprocessandarepackagedinaJEDECstandard14mmx20mm  
100-pin thinplasticquadflatpack(TQFP)aswellasa119 ballgridarray  
(BGA) and a 165 fine pitch ball grid array (fBGA).  
TM  
given the name ZBT , or Zero Bus Turnaround.  
AddressandcontrolsignalsareappliedtotheSRAMduringoneclock  
cycle,andonthenextclockcycletheassociateddatacycleoccurs,be  
PinDescriptionSummary  
A0-A17  
Address Inputs  
Input  
Input  
Input  
Input  
Input  
Input  
Input  
Input  
Input  
Input  
Input  
Input  
Output  
Input  
Input  
I/O  
Synchronous  
Synchronous  
Asynchronous  
Synchronous  
Synchronous  
Synchronous  
N/A  
Chip Enables  
CE1, CE2, CE2  
Output Enable  
OE  
R/W  
Read/Write Signal  
Clock Enable  
CEN  
Individual Byte Write Selects  
Clock  
BW1, BW2, BW3, BW4  
CLK  
ADV/LD  
LBO  
Advance burst address / Load new address  
Linear / Interleaved Burst Order  
Test Mode Select  
Test Data Input  
Synchronous  
Static  
TMS  
TDI  
Synchronous  
Synchronous  
N/A  
TCK  
TDO  
Test Clock  
Test Data Output  
Synchronous  
Asynchronous  
Synchronous  
Synchronous  
Static  
JTAG Reset (Optional)  
Sleep Mode  
TRST  
ZZ  
I/O0-I/O31, I/OP1-I/OP4  
VDD, VDDQ  
Data Input / Output  
Core Power, I/O Power  
Ground  
Supply  
Supply  
VSS  
Static  
5282 tbl 01  
MAY 2002  
1
©2002IntegratedDeviceTechnology,Inc.  
DSC-5282/06  

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