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ICX039DNB PDF预览

ICX039DNB

更新时间： 2024-11-15 22:25:51
品牌 Logo 应用领域
索尼 - SONY 模拟IC传感器图像传感器信号电路摄像机
页数 文件大小 规格书
20页 213K
描述
Diagonal 8mm (Type 1/2) CCD Image Sensor for PAL Color Video Cameras

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ICX039DNB 技术参数

是否Rohs认证： 不符合生命周期：Obsolete
零件包装代码：DIP包装说明：WSDIP,
针数：16Reach Compliance Code：unknown
HTS代码：8542.39.00.01风险等级：5.92
Is Samacsys：N模拟集成电路 - 其他类型：ANALOG CIRCUIT
JESD-30 代码：R-CDIP-T16JESD-609代码：e0
功能数量：1端子数量：16
最高工作温度：60 °C最低工作温度：-10 °C
封装主体材料：CERAMIC, METAL-SEALED COFIRED封装代码：WSDIP
封装形状：RECTANGULAR封装形式：IN-LINE, WINDOW, SHRINK PITCH
峰值回流温度（摄氏度）：NOT SPECIFIED认证状态：Not Qualified
座面最大高度：4.59 mm最大供电电压 (Vsup)：15.45 V
最小供电电压 (Vsup)：14.55 V标称供电电压 (Vsup)：15 V
表面贴装：NO温度等级：COMMERCIAL
端子面层：Tin/Lead (Sn/Pb)端子形式：THROUGH-HOLE
端子节距：1.27 mm端子位置：DUAL
处于峰值回流温度下的最长时间：NOT SPECIFIED宽度：7.62 mm
Base Number Matches：1

ICX039DNB 数据手册

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ICX039DNB  
Diagonal 8mm (Type 1/2) CCD Image Sensor for PAL Color Video Cameras  
Description  
16 pin DIP (Ceramic)  
The ICX039DNB is an interline CCD solid-state  
image sensor suitable for PAL color video cameras  
with a diagonal 8mm (Type 1/2) system. Smear,  
sensitivity, D-range, S/N and other characteristics  
have been greatly improved compared with the  
ICX039BNB. High sensitivity and low dark current  
are achieved through the adoption of Ye, Cy, Mg and  
G complementary color mosaic filters and HAD  
(Hole-Accumulation Diode) sensors.  
This chip features a field period readout system and  
an electronic shutter with variable charge-storage  
time. Also, this outline is miniaturized by using  
original package.  
Pin 1  
2
V
This chip is compatible with and can replace the  
ICX039BNB.  
12  
3
Features  
40  
H
Pin 9  
• Low smear (–20dB compared with the ICX039BNB)  
• High sensitivity (+3.0dB compared with the ICX039BNB)  
• High D range (+2.5dB compared with the ICX039BNB)  
• High S/N  
Optical black position  
(Top View)  
• High resolution and low dark current  
• Excellent antiblooming characteristics  
• Ye, Cy, Mg, and G complementary color mosaic filters on chip  
• Continuous variable-speed shutter  
• Substrate bias:  
Adjustment free (external adjustment also possible with 6 to 14V)  
5Vp-p adjustment free (drive also possible with 0 to 9V)  
5V drive  
• Reset gate pulse:  
• Horizontal register:  
• Maximum package dimensions: φ13.2mm  
Device Structure  
• Interline CCD image sensor  
• Image size:  
Diagonal 8mm (Type 1/2)  
• Number of effective pixels: 752 (H) x 582 (V) approx. 440K pixels  
• Total number of pixels:  
• Chip size:  
795 (H) x 596 (V) approx. 470K pixels  
7.95mm (H) x 6.45mm (V)  
• Unit cell size:  
8.6µm (H) x 8.3µm (V)  
• Optical black:  
Horizontal (H) direction: Front 3 pixels, rear 40 pixels  
Vertical (V) direction : Front 12 pixels, rear 2 pixels  
Horizontal 22  
• Number of dummy bits:  
• Substrate material:  
Vertical 1 (even fields only)  
Silicon  
Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by  
any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the  
operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.  
– 1 –  
E96128C99  
1234567...20

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