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ICX039BNB PDF预览

ICX039BNB

更新时间: 2024-11-15 22:25:43
品牌 Logo 应用领域
索尼 - SONY 模拟IC传感器图像传感器信号电路摄像机
页数 文件大小 规格书
20页 213K
描述
Diagonal 8mm (Type 1/2) CCD Image Sensor for PAL Color Video Cameras

ICX039BNB 技术参数

生命周期:Obsolete零件包装代码:DIP
包装说明:DIP,针数:16
Reach Compliance Code:unknownHTS代码:8542.39.00.01
风险等级:5.84Is Samacsys:N
模拟集成电路 - 其他类型:ANALOG CIRCUITJESD-30 代码:R-CDIP-T16
长度:12.35 mm功能数量:1
端子数量:16封装主体材料:CERAMIC, METAL-SEALED COFIRED
封装代码:DIP封装形状:RECTANGULAR
封装形式:IN-LINE认证状态:Not Qualified
座面最大高度:4.59 mm表面贴装:NO
端子形式:THROUGH-HOLE端子节距:1.27 mm
端子位置:DUAL宽度:7.62 mm
Base Number Matches:1

ICX039BNB 数据手册

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ICX039DNB  
Diagonal 8mm (Type 1/2) CCD Image Sensor for PAL Color Video Cameras  
Description  
16 pin DIP (Ceramic)  
The ICX039DNB is an interline CCD solid-state  
image sensor suitable for PAL color video cameras  
with a diagonal 8mm (Type 1/2) system. Smear,  
sensitivity, D-range, S/N and other characteristics  
have been greatly improved compared with the  
ICX039BNB. High sensitivity and low dark current  
are achieved through the adoption of Ye, Cy, Mg and  
G complementary color mosaic filters and HAD  
(Hole-Accumulation Diode) sensors.  
This chip features a field period readout system and  
an electronic shutter with variable charge-storage  
time. Also, this outline is miniaturized by using  
original package.  
Pin 1  
2
V
This chip is compatible with and can replace the  
ICX039BNB.  
12  
3
Features  
40  
H
Pin 9  
Low smear (–20dB compared with the ICX039BNB)  
High sensitivity (+3.0dB compared with the ICX039BNB)  
High D range (+2.5dB compared with the ICX039BNB)  
High S/N  
Optical black position  
(Top View)  
High resolution and low dark current  
Excellent antiblooming characteristics  
Ye, Cy, Mg, and G complementary color mosaic filters on chip  
Continuous variable-speed shutter  
Substrate bias:  
Adjustment free (external adjustment also possible with 6 to 14V)  
5Vp-p adjustment free (drive also possible with 0 to 9V)  
5V drive  
Reset gate pulse:  
Horizontal register:  
Maximum package dimensions: φ13.2mm  
Device Structure  
Interline CCD image sensor  
Image size:  
Diagonal 8mm (Type 1/2)  
Number of effective pixels: 752 (H) x 582 (V) approx. 440K pixels  
Total number of pixels:  
Chip size:  
795 (H) x 596 (V) approx. 470K pixels  
7.95mm (H) x 6.45mm (V)  
Unit cell size:  
8.6µm (H) x 8.3µm (V)  
Optical black:  
Horizontal (H) direction: Front 3 pixels, rear 40 pixels  
Vertical (V) direction : Front 12 pixels, rear 2 pixels  
Horizontal 22  
Number of dummy bits:  
Substrate material:  
Vertical 1 (even fields only)  
Silicon  
Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by  
any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the  
operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.  
– 1 –  
E96128C99  

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