是否Rohs认证: | 不符合 | 生命周期: | Contact Manufacturer |
零件包装代码: | BGA | 包装说明: | BGA, BGA360,19X19,50 |
针数: | 360 | Reach Compliance Code: | unknown |
ECCN代码: | 3A001.A.3 | HTS代码: | 8542.31.00.01 |
风险等级: | 5.34 | Is Samacsys: | N |
地址总线宽度: | 32 | 位大小: | 32 |
边界扫描: | YES | 最大时钟频率: | 100 MHz |
外部数据总线宽度: | 64 | 格式: | FLOATING POINT |
集成缓存: | YES | JESD-30 代码: | S-CBGA-B360 |
JESD-609代码: | e0 | 长度: | 25 mm |
低功率模式: | YES | 端子数量: | 360 |
最高工作温度: | 65 °C | 最低工作温度: | |
封装主体材料: | CERAMIC, METAL-SEALED COFIRED | 封装代码: | BGA |
封装等效代码: | BGA360,19X19,50 | 封装形状: | SQUARE |
封装形式: | GRID ARRAY | 电源: | 2.05,3.3 V |
认证状态: | Not Qualified | 座面最大高度: | 3.2 mm |
速度: | 333 MHz | 子类别: | Microprocessors |
最大供电电压: | 2.1 V | 最小供电电压: | 2 V |
标称供电电压: | 2.05 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | COMMERCIAL |
端子面层: | Tin/Lead (Sn/Pb) | 端子形式: | BALL |
端子节距: | 1.27 mm | 端子位置: | BOTTOM |
宽度: | 25 mm | uPs/uCs/外围集成电路类型: | MICROPROCESSOR, RISC |
Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
IBM25PPC750L-FB0A350W | IBM |
获取价格 |
RISC Microprocessor, 32-Bit, 350MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BG | |
IBM25PPC750L-FB0A366W | ETC |
获取价格 |
32-Bit Microprocessor | |
IBM25PPC750L-FB0A375W | ETC |
获取价格 |
32-Bit Microprocessor | |
IBM25PPC750L-FB0A400W | ETC |
获取价格 |
32-Bit Microprocessor | |
IBM25PPC750L-FB0A450W | IBM |
获取价格 |
RISC Microprocessor, 32-Bit, 450MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BG | |
IBM25PPC750L-FB0A466W | IBM |
获取价格 |
RISC Microprocessor, 32-Bit, 466MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BG | |
IBM25PPC750L-FB0B300W | IBM |
获取价格 |
RISC Microprocessor, 32-Bit, 300MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BG | |
IBM25PPC750L-FB0B333W | IBM |
获取价格 |
RISC Microprocessor, 32-Bit, 333MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BG | |
IBM25PPC750L-FB0B350W | IBM |
获取价格 |
RISC Microprocessor, 32-Bit, 350MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BG | |
IBM25PPC750L-FB0B366W | ETC |
获取价格 |
32-Bit Microprocessor |