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I1760PYI01 PDF预览

I1760PYI01

更新时间: 2024-11-09 18:59:39
品牌 Logo 应用领域
华邦 - WINBOND 光电二极管商用集成电路
页数 文件大小 规格书
24页 351K
描述
Speech Synthesizer With RCDG, 120s, PDIP28, 0.600 INCH, LEAD FREE, PLASTIC, DIP-28

I1760PYI01 技术参数

生命周期:Obsolete零件包装代码:DIP
包装说明:DIP,针数:28
Reach Compliance Code:unknownHTS代码:8542.39.00.01
风险等级:5.61商用集成电路类型:SPEECH SYNTHESIZER WITH RCDG
JESD-30 代码:R-PDIP-T28JESD-609代码:e3
长度:36.83 mm功能数量:1
端子数量:28片上内存类型:FLASH
最高工作温度:85 °C最低工作温度:-40 °C
封装主体材料:PLASTIC/EPOXY封装代码:DIP
封装形状:RECTANGULAR封装形式:IN-LINE
认证状态:Not Qualified最长读取时间:120 s
座面最大高度:4.83 mm最大供电电压 (Vsup):5.5 V
最小供电电压 (Vsup):2.4 V表面贴装:NO
温度等级:INDUSTRIAL端子面层:MATTE TIN
端子形式:THROUGH-HOLE端子节距:2.54 mm
端子位置:DUAL宽度:15.24 mm
Base Number Matches:1

I1760PYI01 数据手册

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PRELIMINARY  
ISD1700  
Series  
Multi-Message  
Single-Chip  
Voice Record & Playback Devices  
Publication Release Date: January 23, 2007  
Revision 1.3-S2  

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Speech Synthesizer With RCDG, 120s, PDSO28, 0.300 INCH, LEAD FREE, PLASTIC, SOIC-28
I1760SYIR01 WINBOND

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Speech Synthesizer With RCDG, 120s, PDSO28, 0.300 INCH, LEAD FREE, PLASTIC, SOIC-28