5秒后页面跳转
I1750XYR01 PDF预览

I1750XYR01

更新时间: 2024-01-18 17:51:09
品牌 Logo 应用领域
华邦 - WINBOND 商用集成电路
页数 文件大小 规格书
24页 351K
描述
Speech Synthesizer With RCDG, 100s, DIE

I1750XYR01 技术参数

生命周期:Obsolete零件包装代码:DIE
包装说明:DIE,Reach Compliance Code:unknown
HTS代码:8542.39.00.01风险等级:5.7
商用集成电路类型:SPEECH SYNTHESIZER WITH RCDGJESD-30 代码:X-XUUC-N
功能数量:1片上内存类型:FLASH
最高工作温度:50 °C最低工作温度:
封装主体材料:UNSPECIFIED封装代码:DIE
封装形状:UNSPECIFIED封装形式:UNCASED CHIP
认证状态:Not Qualified最长读取时间:100 s
最大供电电压 (Vsup):5.5 V最小供电电压 (Vsup):2.4 V
表面贴装:YES温度等级:COMMERCIAL
端子形式:NO LEAD端子位置:UPPER
Base Number Matches:1

I1750XYR01 数据手册

 浏览型号I1750XYR01的Datasheet PDF文件第2页浏览型号I1750XYR01的Datasheet PDF文件第3页浏览型号I1750XYR01的Datasheet PDF文件第4页浏览型号I1750XYR01的Datasheet PDF文件第5页浏览型号I1750XYR01的Datasheet PDF文件第6页浏览型号I1750XYR01的Datasheet PDF文件第7页 
PRELIMINARY  
ISD1700  
Series  
Multi-Message  
Single-Chip  
Voice Record & Playback Devices  
Publication Release Date: January 23, 2007  
Revision 1.3-S2  

与I1750XYR01相关器件

型号 品牌 描述 获取价格 数据表
I1760EY WINBOND Speech Synthesizer With RCDG, 120s, PDSO28, 8 X 13.40 MM, LEAD FREE, PLASTIC, TSOP1-28

获取价格

I1760EY01 WINBOND Speech Synthesizer With RCDG, 120s, PDSO28, 8 X 13.40 MM, LEAD FREE, PLASTIC, TSOP1-28

获取价格

I1760EYI WINBOND Speech Synthesizer With RCDG, 120s, PDSO28, 8 X 13.40 MM, LEAD FREE, PLASTIC, TSOP1-28

获取价格

I1760EYI01 WINBOND Speech Synthesizer With RCDG, 120s, PDSO28, 8 X 13.40 MM, LEAD FREE, PLASTIC, TSOP1-28

获取价格

I1760EYIR WINBOND Speech Synthesizer With RCDG, 120s, PDSO28, 8 X 13.40 MM, LEAD FREE, PLASTIC, TSOP1-28

获取价格

I1760EYIR01 WINBOND Speech Synthesizer With RCDG, 120s, PDSO28, 8 X 13.40 MM, LEAD FREE, PLASTIC, TSOP1-28

获取价格