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I1750SYIR01 PDF预览

I1750SYIR01

更新时间: 2024-02-15 11:20:47
品牌 Logo 应用领域
华邦 - WINBOND 光电二极管商用集成电路
页数 文件大小 规格书
24页 351K
描述
Speech Synthesizer With RCDG, 100s, PDSO28, 0.300 INCH, LEAD FREE, PLASTIC, SOIC-28

I1750SYIR01 技术参数

生命周期:Obsolete零件包装代码:SOIC
包装说明:SOP,针数:28
Reach Compliance Code:unknownHTS代码:8542.39.00.01
风险等级:5.7Is Samacsys:N
商用集成电路类型:SPEECH SYNTHESIZER WITH RCDGJESD-30 代码:R-PDSO-G28
JESD-609代码:e3长度:17.93 mm
功能数量:1端子数量:28
片上内存类型:FLASH最高工作温度:85 °C
最低工作温度:-40 °C封装主体材料:PLASTIC/EPOXY
封装代码:SOP封装形状:RECTANGULAR
封装形式:SMALL OUTLINE认证状态:Not Qualified
最长读取时间:100 s座面最大高度:2.64 mm
最大供电电压 (Vsup):5.5 V最小供电电压 (Vsup):2.4 V
表面贴装:YES温度等级:INDUSTRIAL
端子面层:MATTE TIN端子形式:GULL WING
端子节距:1.27 mm端子位置:DUAL
宽度:7.52 mmBase Number Matches:1

I1750SYIR01 数据手册

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PRELIMINARY  
ISD1700  
Series  
Multi-Message  
Single-Chip  
Voice Record & Playback Devices  
Publication Release Date: January 23, 2007  
Revision 1.3-S2  

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