是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Obsolete | 零件包装代码: | TSOP |
包装说明: | TSOP1, | 针数: | 28 |
Reach Compliance Code: | unknown | HTS代码: | 8542.39.00.01 |
风险等级: | 5.84 | 应用: | CELLULAR PHONE; PORTABLE APPLIANCES |
商用集成电路类型: | SPEECH SYNTHESIZER WITH RCDG | JESD-30 代码: | R-PDSO-G28 |
长度: | 11.8 mm | 湿度敏感等级: | 3 |
功能数量: | 1 | 端子数量: | 28 |
片上内存类型: | FLASH | 最高工作温度: | 85 °C |
最低工作温度: | -40 °C | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | TSOP1 | 封装形状: | RECTANGULAR |
封装形式: | SMALL OUTLINE, THIN PROFILE | 峰值回流温度(摄氏度): | 260 |
认证状态: | Not Qualified | 最长读取时间: | 300 s |
座面最大高度: | 1.25 mm | 最大供电电压 (Vsup): | 3.3 V |
最小供电电压 (Vsup): | 2.7 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | INDUSTRIAL |
端子形式: | GULL WING | 端子节距: | 0.55 mm |
端子位置: | DUAL | 处于峰值回流温度下的最长时间: | 40 |
宽度: | 8 mm | Base Number Matches: | 1 |
型号 | 品牌 | 描述 | 获取价格 | 数据表 |
I14305P | WINBOND | Speech Synthesizer With RCDG, 300s, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28 |
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I14305PY | WINBOND | Speech Synthesizer With RCDG, 300s, CMOS, PDIP28, 0.600 INCH, LEAD FREE, PLASTIC, DIP-28 |
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I14305S | WINBOND | Speech Synthesizer With RCDG, 300s, CMOS, PDSO28, 0.300 INCH, PLASTIC, SOIC-28 |
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I14305SI | WINBOND | Speech Synthesizer With RCDG, 300s, CMOS, PDSO28, 0.300 INCH, PLASTIC, SOIC-28 |
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I14305SY | WINBOND | Speech Synthesizer With RCDG, 300s, CMOS, PDSO28, 0.300 INCH, LEAD FREE, PLASTIC, SOIC-28 |
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I14305SYI | WINBOND | Speech Synthesizer With RCDG, 300s, CMOS, PDSO28, 0.300 INCH, LEAD FREE, PLASTIC, SOIC-28 |
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