LATTICE ICE40 MOBILE SOLUTIONS
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Lattice iCE40 Mobile Solutions
The iCE40™ Ultra Low Power FPGA family is designed to address
always on functions in mobile consumer devices. These functions
extend from IR sub-systems, custom connectivity as well as sensor
management solutions.
The nature of always on functions present challenges to mobile
designers due to constant current drain from the battery. By
leveraging 40-nm low-power CMOS process and low power
circuit design, the iCE40™ family delivers the lowest active and
standby power consumption solutions in the market. This enables
applications like sensor management in smartphones to collect and
analyze mutiple sensor data streams in realtime and transform data
in to information while keeping processors in low their lowest power
mode.
iCE40™ Ultra Low Power FPGAs are offered in ultra-small form
factor packages, which makes it well suited for area constrained
applications like smartphones and tablets.
Key Features
Flexible Logic Architecture
Integrated Hard Cores
• Multilple devices with 384 to 7680 LUTs
• Up to 18 I/O pins WLCSP package
• Up to 178 I/O in BGA package
• Hard I2C & SPI Cores
• Low Power & High-Speed Strobe Generator
• Flexible Device Configuration through SPI
Flexible On-Chip Clocking
• Six low-skew global signal resources
• Phase Lock Loops
Ultra-low Power Devices
• Advanced 40 nm ultra-low power
• As low as 45 µW standby power
Ultra-Small Form Factor
Embedded and Distributed Memory
• As small as 16-pin WLCSP package 1.40mm x 1.48mm
• Up to 128 Kbits sysMEM™ Embedded Block RAM
iCE40 Device Selection Guide
LP Series (Low Power)
Features
LP384
LP640
LP1K
LP4K
LP8K
Logic Cells
384
640
1280
3520
7680
Typical (µA, @ 0KHz, 1.2V Vcc)
Embedded RAM Bits
100
100
360
360
0
-
-
-
-
-
-
64K
64K
80K
128K
Phase-Locked Loop Core
I2C Core
-
-
1
2
-
2
-
-
SPI Core
-
-
-
-
Low Power Strobe Generator
High Frequency Strobe Generator
24mA Current Sink
-
-
-
-
-
-
-
-
3
3
-
-
Packages1
I/O Pins (dedicated I/Os)
10(2)2
10(2)2
16-ball WLCSP (1.40 x 1.48 mm)
25-ball WLCSP (1.71 x 1.71 mm)
36-ball ucBGA (2.5 x 2.5 mm)
49-ball ucBGA (3 x 3 mm)
81-ball ucBGA (4 x 4 mm)
121-ball ucBGA (5 x 5 mm)
81-ball csBGA2 (5 x 5 mm)
32-pin QNF (5 x 5 mm)
121-ball csBGA (6 x 6 mm)
225-ball ucBGA (7 x 7 mm)
84-pin QNFS2 (7 x 7 mm)
25(2)
37(2)
25(2)3
35(2)3
63(2)3
95(2)3
62(2)3
63(2)4
93(2)
63(2)4
93(2)
21(4)
92(2)3
67(2)3
178(3)
178(3)
1. Packages: WLCSP - 0.35 mm pitch chip scale ball grid array, csBGA - 0.5 mm pitch Chip-Scale Ball Grid Array, ucBGA - 0.4 mm pitch Chip-Scale Ball Grid Array,
caBGA - 0.8 mm pitch Ball Grid Array
2. No PLL available
3. No 24mA current sink
4. Only 1 PLL available
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