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I0255 PDF预览

I0255

更新时间: 2023-12-20 18:44:34
品牌 Logo 应用领域
莱迪思 - LATTICE /
页数 文件大小 规格书
2页 960K
描述
iCE40 UltraPlus Product Brochure

I0255 数据手册

 浏览型号I0255的Datasheet PDF文件第2页 
TM  
iCE40 UltraPlus™  
World’s smallest FPGAs with enhanced memory & DSPs for reduced system  
cost, lower power consumption & faster time-to-market  
iCE40 UltraPlusis the latest addition to the popular iCE40FPGA product family. It is the world’s smallest distributed processing  
solution with up to 1 Mbit of integrated SRAM memory that can be used for buffering sensor data or storing embedded processor  
code. With its flexible I/Os, compute capabilities, hardware accelerators, and integrated DSP blocks (x8 DSP blocks in the 5K version),  
iCE40 UltraPlus is the go-to tool for technology innovators/designers to solve repetitive number crunching problems and extend system  
battery life by allowing the applications processor (AP) to stay in sleep mode longer.  
Key Features and Benefits  
Flexible I/Os  
Connect, bridge, and aggregate a variety of signaling  
standards  
Small Packages with High Functional Density  
2.15 mm x 2.55 mm WLCSP package  
Up to 5,280 LUTs  
- I2C, SPI, I3C, UART, I2S, and other proprietary interfaces  
Improve board layout through aggregation of multiple signals  
over a single interface  
Dynamic I/O placement can be adjusted to fit your layout  
needs  
Up to 8 DSP blocks (16 x 16 multiply, 32-bit Accumulator  
blocks)  
Up to 4 SPRAM blocks of 256 kbits  
Instant on with integrated NVCM configuration memory  
120 kbits of Block RAM  
ꢀ PowerꢀEfficient  
75µW (typical) static power consumption  
Active power depends on use case  
Product Family Overview  
Adding to the iCE40 family of small size and power efficient FPGAs, iCE40 UltraPlus offers more resources, while providing the same low  
power and small footprint required for the mobile market.  
iCE40 UltraLite  
iCE40 Ultra  
iCE40 UltraPlus  
Device  
iCE40UL640  
iCE40UL1K  
iCE5LP1K  
iCE5LP2K  
iCE5LP4K  
iCE40UP3K  
iCE40UP5K  
Static Current Draw (uA)  
LUTs  
35  
640  
56  
-
35  
71  
1100  
64  
-
71  
71  
3520  
80  
-
75  
2800  
80  
75  
5280  
120  
1024  
1
1248  
2048  
Embedded Block RAM (kbits)  
SPRAM Memory (kbits)  
PLL  
56  
-
80  
-
1024  
1
1
1
-
1
1
1
16 x 16 Multipliers  
Packages  
-
2
4
4
4
8
Number of User I/Os  
16-ball WLCSP (1.4 x 1.4 mm,  
0.35 mm pitch)  
10  
10  
36-ball WLCSP (2.08 x 2.08  
mm, 0.35 mm pitch)  
26  
26  
26  
30-ball WLCSP (2.15 x 2.55  
mm, 0.4 mm pitch)  
21  
21  
36-ball ucBGA (2.5 x 2.5 mm,  
0.4 mm pitch)  
26  
26  
*
36-ball ucfBGA (2.5 x 2.5 mm,  
0.4 mm pitch)  
26  
39  
26  
39  
26  
39  
48-ball QFN (7 x 7 mm, 0.5  
mm pitch)  
39  
The arrows above indicate that you can design a single PCB and migrate between the products without any PCB board changes.  
* Note: The height of the iCE40 UltraLite 36-ball ucBGA is not the same as the iCE40 Ultra 36-ball ucfBGA package. However, the PCB  
footprint will be the same between the two parts to achieve PCB migration.  
LATTICESEMI.COM  

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