TM
iCE40 UltraPlus™
World’s smallest FPGAs with enhanced memory & DSPs for reduced system
cost, lower power consumption & faster time-to-market
iCE40 UltraPlus™ is the latest addition to the popular iCE40™ FPGA product family. It is the world’s smallest distributed processing
solution with up to 1 Mbit of integrated SRAM memory that can be used for buffering sensor data or storing embedded processor
code. With its flexible I/Os, compute capabilities, hardware accelerators, and integrated DSP blocks (x8 DSP blocks in the 5K version),
iCE40 UltraPlus is the go-to tool for technology innovators/designers to solve repetitive number crunching problems and extend system
battery life by allowing the applications processor (AP) to stay in sleep mode longer.
Key Features and Benefits
Flexible I/Os
• Connect, bridge, and aggregate a variety of signaling
standards
Small Packages with High Functional Density
• 2.15 mm x 2.55 mm WLCSP package
• Up to 5,280 LUTs
- I2C, SPI, I3C, UART, I2S, and other proprietary interfaces
• Improve board layout through aggregation of multiple signals
over a single interface
• Dynamic I/O placement can be adjusted to fit your layout
needs
• Up to 8 DSP blocks (16 x 16 multiply, 32-bit Accumulator
blocks)
• Up to 4 SPRAM blocks of 256 kbits
• Instant on with integrated NVCM configuration memory
• 120 kbits of Block RAM
ꢀ PowerꢀEfficient
• 75µW (typical) static power consumption
• Active power depends on use case
Product Family Overview
Adding to the iCE40 family of small size and power efficient FPGAs, iCE40 UltraPlus offers more resources, while providing the same low
power and small footprint required for the mobile market.
iCE40 UltraLite
iCE40 Ultra
iCE40 UltraPlus
Device
iCE40UL640
iCE40UL1K
iCE5LP1K
iCE5LP2K
iCE5LP4K
iCE40UP3K
iCE40UP5K
Static Current Draw (uA)
LUTs
35
640
56
-
35
71
1100
64
-
71
71
3520
80
-
75
2800
80
75
5280
120
1024
1
1248
2048
Embedded Block RAM (kbits)
SPRAM Memory (kbits)
PLL
56
-
80
-
1024
1
1
1
-
1
1
1
16 x 16 Multipliers
Packages
-
2
4
4
4
8
Number of User I/Os
16-ball WLCSP (1.4 x 1.4 mm,
0.35 mm pitch)
10
10
36-ball WLCSP (2.08 x 2.08
mm, 0.35 mm pitch)
26
26
26
30-ball WLCSP (2.15 x 2.55
mm, 0.4 mm pitch)
21
21
36-ball ucBGA (2.5 x 2.5 mm,
0.4 mm pitch)
26
26
*
36-ball ucfBGA (2.5 x 2.5 mm,
0.4 mm pitch)
26
39
26
39
26
39
48-ball QFN (7 x 7 mm, 0.5
mm pitch)
39
The arrows above indicate that you can design a single PCB and migrate between the products without any PCB board changes.
* Note: The height of the iCE40 UltraLite 36-ball ucBGA is not the same as the iCE40 Ultra 36-ball ucfBGA package. However, the PCB
footprint will be the same between the two parts to achieve PCB migration.
LATTICESEMI.COM