82563EB/82564EB Gigabit Platform LAN
Connect
Networking Silicon
Datasheet
Product Features
■ IEEE 802.3ab compliant
—Allows PHY placement proximity to I/O
back panel.
—Robust operation over the installed base of
Category-5 (Cat-5) twisted pair cabling
■ PICMG 3.1 compliant
■ 7 LED outputs per port (4 configurable plus 3
dedicated)
—Link and Activity indications (10, 100,
1000 Mb/s) on each port
—Robust operation in backplane over
Ethernet applications.
■ Clock supplied to the 631xESB/632xESB
—Cost optimized design
■ Support for cable line lengths greater than
100 m (spec); 123 m physical
—Robust end to end connections over
various cable lengths
■ Full chip power down
—Support for lowest power state
■ 100 pin TQFP Package
■ Full duplex at 10, 100, or 1000 Mb/s and half
duplex at 10 or 100 Mb/s.
—Smaller footprint and lower power
dissipation compared to multi-chip MAC
and PHY solutions
■ IEEE 802.3ab Auto-negotiation with Next
Page support
—Automatic link configuration including
speed, duplex, and flow control
■ 10/100 downshift
■ Operating temperature: 0°C to 60° C
(maximum) – heat sink or forced airflow not
required
—Automatic link speed adjustment with
poor quality cable
■ Automatic MDI crossover
—Simple thermal design
■ Power Consumption: < 1.0 Watts per port
(silicon power)
—Helps to correct for infrastructure issues
■ Advanced Cable Diagnostics
—Improved end-user troubleshooting
■ Kumeran interface
—Minimize impact of incorporating dual
Gigabit instead of Fast Ethernet
■ Leaded and lead-freea 100-pin TQFL with an
Exposed-Pad*. Devices that are lead-free are
marked with a circled “e3” and have a
product code: HYXXXXX
—Low pin count, high speed interface to the
Intel® 631xESB/632xESB I/O Controller
Hub
a.This device is lead-free. That is, lead has not been intentionally added, but lead may still exist as an impurity at <1000 ppm.
The Material Declaration Data Sheet, which includes lead impurity levels and the concentration of other Restriction on Hazard-
ous Substances (RoHS) -banned materials, is available at:
ftp://download.intel.com/design/packtech/material_content_IC_Pack
In addition, this device has been tested and conforms to the same parametric specifications as previous versions of the device.
For more information regarding lead-free products from Intel Corporation, contact your Intel Field Sales representative.
316534-004
Revision 2.9