5秒后页面跳转
HY29DS162TT-12 PDF预览

HY29DS162TT-12

更新时间: 2024-01-20 22:17:10
品牌 Logo 应用领域
海力士 - HYNIX 闪存存储内存集成电路光电二极管
页数 文件大小 规格书
48页 546K
描述
16 Megabit (2M x 8/1M x 16) Super-Low Voltage, Dual Bank, Simultaneous Read/Write, Flash Memory

HY29DS162TT-12 技术参数

是否Rohs认证:不符合生命周期:Obsolete
零件包装代码:TSOP包装说明:TSOP-48
针数:48Reach Compliance Code:compliant
ECCN代码:EAR99HTS代码:8542.32.00.51
风险等级:5.92Is Samacsys:N
最长访问时间:120 ns备用内存宽度:8
启动块:TOP命令用户界面:YES
通用闪存接口:YES数据轮询:YES
JESD-30 代码:R-PDSO-G48JESD-609代码:e0
长度:18.4 mm内存密度:16777216 bit
内存集成电路类型:FLASH内存宽度:16
功能数量:1部门数/规模:8,31
端子数量:48字数:1048576 words
字数代码:1000000工作模式:ASYNCHRONOUS
最高工作温度:85 °C最低工作温度:-40 °C
组织:1MX16封装主体材料:PLASTIC/EPOXY
封装代码:TSOP1封装等效代码:TSSOP48,.8,20
封装形状:RECTANGULAR封装形式:SMALL OUTLINE, THIN PROFILE
并行/串行:PARALLEL峰值回流温度(摄氏度):NOT SPECIFIED
电源:2 V编程电压:1.8 V
认证状态:Not Qualified就绪/忙碌:YES
座面最大高度:1.2 mm部门规模:8K,64K
最大待机电流:0.000005 A子类别:Flash Memories
最大压摆率:0.024 mA最大供电电压 (Vsup):2.2 V
最小供电电压 (Vsup):1.8 V标称供电电压 (Vsup):2 V
表面贴装:YES技术:CMOS
温度等级:INDUSTRIAL端子面层:Tin/Lead (Sn/Pb)
端子形式:GULL WING端子节距:0.5 mm
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
切换位:YES类型:NOR TYPE
宽度:12 mmBase Number Matches:1

HY29DS162TT-12 数据手册

 浏览型号HY29DS162TT-12的Datasheet PDF文件第2页浏览型号HY29DS162TT-12的Datasheet PDF文件第3页浏览型号HY29DS162TT-12的Datasheet PDF文件第4页浏览型号HY29DS162TT-12的Datasheet PDF文件第5页浏览型号HY29DS162TT-12的Datasheet PDF文件第6页浏览型号HY29DS162TT-12的Datasheet PDF文件第7页 
HY29DS162/HY29DS163  
16 Megabit (2M x 8/1M x 16) Super-Low Voltage,  
Dual Bank, Simultaneous Read/Write, Flash Memory  
KEY FEATURES  
n Data# Polling and Toggle Bits  
n Single Power Supply Operation  
Read, program, and erase operations  
from 1.8 to 2.2 V (2.0V ± 10%)  
Provide software confirmation of completion  
of program or erase operations  
n Ready/Busy# Pin  
Ideal for battery-powered applications  
n Simultaneous Read/Write Operations  
Host system can program or erase in one  
bank while simultaneously reading from any  
sector in the other bank with zero latency  
between read and write operations  
Provides hardware confirmation of  
completion of program or erase operations  
n Erase Suspend  
Suspends an erase operation to allow  
programming data to or reading data from  
a sector in the same bank  
n High Performance  
Erase Resume can then be invoked to  
complete the suspended erasure  
n Hardware Reset Pin (RESET#) Resets the  
Device to Reading Array Data  
120 and 130 ns access time versions with  
± 10% power supply and 30pF load  
n Ultra Low Power Consumption (Typical  
Values)  
n WP#/ACC Input Pin  
Automatic sleep mode current: 200 nA  
Write protect (WP#) function allows  
hardware protection of two outermost boot  
sectors, regardless of sector protect status  
Acceleration (ACC) function provides  
accelerated program times  
Standby mode current: 200 nA  
Read current: 5 mA (at 5 MHz)  
Program/erase current: 15 mA  
n Boot-Block Sector Architecture with 39  
Sectors in Two Banks for Fast In-System  
Code Changes  
n Fast Program and Erase Times  
Sector erase time: 1 sec typical  
Byte/Word program time utilizing  
Acceleration function: 13 µs typical  
n Space Efficient Packaging  
n Secured Sector: An Extra 64 Kbyte Sector  
that Can Be:  
Factory locked and identifiable: 16 bytes  
available for a secure, random factory-  
programmed Electronic Serial Number  
Customer lockable: Can be read, program-  
med, or erased just like other sectors  
n Flexible Sector Architecture  
48-pin TSOP and 48-ball FBGA packages  
LOGIC DIAGRAM  
Sector Protection allows locking of a  
sector or sectors to prevent program or  
erase operations within that sector  
Temporary Sector Unprotect allows  
changes in locked sectors (requires high  
voltage on RESET# pin)  
20  
8
7
A[19:0]  
CE#  
DQ[7:0]  
n Automatic Erase Algorithm Erases Any  
Combination of Sectors or the Entire Chip  
n Automatic Program Algorithm Writes and  
Verifies Data at Specified Addresses  
n Compliant with Common Flash Memory  
Interface (CFI) Specification  
n Minimum 100,000 Write Cycles per Sector  
(1,000,000 cycles Typical)  
n Compatible with JEDEC Standards  
Pinout and software compatible with  
single-power supply Flash devices  
Superior inadvertent write protection  
DQ[14:8]  
DQ[15]/A[-1]  
WP#/ACC  
RY/BY#  
OE#  
W E#  
RESET#  
BYTE#  
Preliminary  
Revision 1.3, April 2001  

与HY29DS162TT-12相关器件

型号 品牌 获取价格 描述 数据表
HY29DS162TT-12I HYNIX

获取价格

16 Megabit (2M x 8/1M x 16) Super-Low Voltage, Dual Bank, Simultaneous Read/Write, Flash M
HY29DS162TT-13 HYNIX

获取价格

16 Megabit (2M x 8/1M x 16) Super-Low Voltage, Dual Bank, Simultaneous Read/Write, Flash M
HY29DS162TT-13I HYNIX

获取价格

16 Megabit (2M x 8/1M x 16) Super-Low Voltage, Dual Bank, Simultaneous Read/Write, Flash M
HY29DS163 HYNIX

获取价格

16 Megabit (2M x 8/1M x 16) Super-Low Voltage, Dual Bank, Simultaneous Read/Write, Flash M
HY29DS163BF-12 HYNIX

获取价格

16 Megabit (2M x 8/1M x 16) Super-Low Voltage, Dual Bank, Simultaneous Read/Write, Flash M
HY29DS163BF-12I HYNIX

获取价格

16 Megabit (2M x 8/1M x 16) Super-Low Voltage, Dual Bank, Simultaneous Read/Write, Flash M
HY29DS163BF-13 HYNIX

获取价格

16 Megabit (2M x 8/1M x 16) Super-Low Voltage, Dual Bank, Simultaneous Read/Write, Flash M
HY29DS163BF-13I HYNIX

获取价格

16 Megabit (2M x 8/1M x 16) Super-Low Voltage, Dual Bank, Simultaneous Read/Write, Flash M
HY29DS163BT-12 HYNIX

获取价格

16 Megabit (2M x 8/1M x 16) Super-Low Voltage, Dual Bank, Simultaneous Read/Write, Flash M
HY29DS163BT-12I HYNIX

获取价格

16 Megabit (2M x 8/1M x 16) Super-Low Voltage, Dual Bank, Simultaneous Read/Write, Flash M