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HY27US08281A-TPCB PDF预览

HY27US08281A-TPCB

更新时间: 2024-11-19 13:02:11
品牌 Logo 应用领域
海力士 - HYNIX 闪存
页数 文件大小 规格书
44页 345K
描述
Flash, 16MX8, 30ns, PDSO48, 12 X 20 MM, 1.20 MM HEIGHT, LEAD FREE, TSOP1-48

HY27US08281A-TPCB 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Obsolete零件包装代码:TSOP1
包装说明:12 X 20 MM, 1.20 MM HEIGHT, LEAD FREE, TSOP1-48针数:48
Reach Compliance Code:unknownECCN代码:3A991.B.1.A
HTS代码:8542.32.00.51风险等级:5.8
最长访问时间:30 ns命令用户界面:YES
数据轮询:NOJESD-30 代码:R-PDSO-G48
JESD-609代码:e6长度:18.4 mm
内存密度:134217728 bit内存集成电路类型:FLASH
内存宽度:8湿度敏感等级:3
功能数量:1部门数/规模:1K
端子数量:48字数:16777216 words
字数代码:16000000工作模式:ASYNCHRONOUS
最高工作温度:70 °C最低工作温度:
组织:16MX8封装主体材料:PLASTIC/EPOXY
封装代码:TSOP1封装等效代码:TSSOP48,.8,20
封装形状:RECTANGULAR封装形式:SMALL OUTLINE, THIN PROFILE
页面大小:512 words并行/串行:PARALLEL
峰值回流温度(摄氏度):260电源:3.3 V
编程电压:3.3 V认证状态:Not Qualified
就绪/忙碌:YES座面最大高度:1.2 mm
部门规模:16K最大待机电流:0.00005 A
子类别:Flash Memories最大压摆率:0.02 mA
最大供电电压 (Vsup):3.6 V最小供电电压 (Vsup):2.7 V
标称供电电压 (Vsup):3.3 V表面贴装:YES
技术:CMOS温度等级:COMMERCIAL
端子面层:Tin/Bismuth (Sn/Bi)端子形式:GULL WING
端子节距:0.5 mm端子位置:DUAL
处于峰值回流温度下的最长时间:20切换位:NO
类型:NAND TYPE宽度:12 mm
Base Number Matches:1

HY27US08281A-TPCB 数据手册

 浏览型号HY27US08281A-TPCB的Datasheet PDF文件第2页浏览型号HY27US08281A-TPCB的Datasheet PDF文件第3页浏览型号HY27US08281A-TPCB的Datasheet PDF文件第4页浏览型号HY27US08281A-TPCB的Datasheet PDF文件第5页浏览型号HY27US08281A-TPCB的Datasheet PDF文件第6页浏览型号HY27US08281A-TPCB的Datasheet PDF文件第7页 
HY27US(08/16)281A Series  
128Mbit (16Mx8bit / 8Mx16bit) NAND Flash  
Document Title  
128Mbit (16Mx8bit / 8Mx16bit) NAND Flash Memory  
Revision History  
Revision  
History  
No.  
Draft Date  
Remark  
0.0  
Sep. 2004  
Preliminary  
Initial Draft.  
1) Correct Summary description & page.7  
- The Cache feature is deleted in summary description.  
- Note.3 is deleted. (page.7)  
2) Correct table.5 & Table.12  
3) Correct TSOp1, WSOP1 Pin description  
- 38th pin has been changed Lockpre  
0.1  
Nov. 29. 2004  
Preliminary  
4) Add Bad Block Management & System Interface using CE don’t care  
5) Change TSOP1, WSOP1, FBGA package dimension & figures.  
- Change TSOP1, WSOP1, FBGA package mechanical data  
- Change TSOP1, WSOP1 package figures  
1) LOCKPRE is changed to PRE.  
- Texts, Tables and figures are changed.  
2) Change Command Set  
- READ A and B are changed to READ 1.  
- READ C is changed to READ 2.  
3) Change AC, DC characterics  
- tRB, tCRY, tCEH and tOH are added.  
4) Correct Program time (max)  
- before : 700us  
0.2  
Mar. 03. 2005  
Preliminary  
- after : 500us  
5) Edit figures  
- Address names are changed.  
6) Change AC characterics  
tRP  
30  
tREA  
35  
Before  
After  
25  
30  
Rev 0.6 / Nov. 2005  
1

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