5秒后页面跳转
HY27SS16561M-FEP PDF预览

HY27SS16561M-FEP

更新时间: 2024-11-13 13:08:27
品牌 Logo 应用领域
海力士 - HYNIX 闪存
页数 文件大小 规格书
47页 424K
描述
Flash, 16MX16, 10000ns, PBGA63, 11 X 9 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, FBGA-63

HY27SS16561M-FEP 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
零件包装代码:BGA包装说明:11 X 9 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, FBGA-63
针数:63Reach Compliance Code:unknown
ECCN代码:3A991.B.1.AHTS代码:8542.32.00.51
风险等级:5.92最长访问时间:10000 ns
JESD-30 代码:R-PBGA-B63长度:11 mm
内存密度:268435456 bit内存集成电路类型:FLASH
内存宽度:16功能数量:1
端子数量:63字数:16777216 words
字数代码:16000000工作模式:ASYNCHRONOUS
最高工作温度:85 °C最低工作温度:-25 °C
组织:16MX16封装主体材料:PLASTIC/EPOXY
封装代码:TFBGA封装形状:RECTANGULAR
封装形式:GRID ARRAY, THIN PROFILE, FINE PITCH并行/串行:PARALLEL
峰值回流温度(摄氏度):NOT SPECIFIED编程电压:1.8 V
认证状态:Not Qualified座面最大高度:1.2 mm
最大供电电压 (Vsup):1.95 V最小供电电压 (Vsup):1.7 V
标称供电电压 (Vsup):1.8 V表面贴装:YES
技术:CMOS温度等级:OTHER
端子形式:BALL端子节距:0.8 mm
端子位置:BOTTOM处于峰值回流温度下的最长时间:NOT SPECIFIED
类型:NAND TYPE宽度:9 mm
Base Number Matches:1

HY27SS16561M-FEP 数据手册

 浏览型号HY27SS16561M-FEP的Datasheet PDF文件第2页浏览型号HY27SS16561M-FEP的Datasheet PDF文件第3页浏览型号HY27SS16561M-FEP的Datasheet PDF文件第4页浏览型号HY27SS16561M-FEP的Datasheet PDF文件第5页浏览型号HY27SS16561M-FEP的Datasheet PDF文件第6页浏览型号HY27SS16561M-FEP的Datasheet PDF文件第7页 
HY27US(08/16)561A Series  
HY27SS(08/16)561A Series  
256Mbit (32Mx8bit / 16Mx16bit) NAND Flash  
Document Title  
256Mbit (32Mx8bit / 16Mx16bit) NAND Flash Memory  
Revision History  
Revision  
History  
No.  
Draft Date  
Remark  
0.0  
Apr. 04. 2005  
Preliminary  
Initial Draft.  
1) Change AC Parameter  
tCRY(1.8V)  
Before  
After  
50+tr(R/B#)  
60+tr(R/B#)  
0.1  
Jul. 07. 2005  
Preliminary  
2) Change 256Mb Package Type.  
- WSOP package is changed to USOP package.  
- Figure & dimension are changed.  
1) Correct the test Conditions (DC Characteristics table)  
Test Conditions (ICC1)  
Test Conditions (ILI, ILO)  
tRC=50ns,  
CE#=VIL,  
IOUT=0mA  
Before  
After  
VIN=VOUT=0 to 3.6V  
tRC(1.8V=60ns,  
3.3V=50ns)  
CE#=VIL,  
VIN=VOUT=0 to Vcc (max)  
IOUT=0mA  
2) Change AC Conditions table  
0.2  
Aug. 08. 2005 Preliminary  
3) Add tWW parameter ( tWW = 100ns, min)  
- Texts & Figures are added.  
- tWW is added in AC timing characteristics table.  
4) Edit Copy Back Program operation step  
5) Edit System Interface Using CE don’t care Figures.  
6) Correct Address Cycle Map.  
7) Change NOP (table 11)  
Main Array  
Spare Array  
Before  
After  
1
2
2
3
Rev 0.5 / Jun. 2006  
1

与HY27SS16561M-FEP相关器件

型号 品牌 获取价格 描述 数据表
HY27SS16561M-FES HYNIX

获取价格

Flash, 16MX16, 10000ns, PBGA63, 11 X 9 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, FBGA-63
HY27SS16561M-FI HYNIX

获取价格

Flash, 16MX16, 35ns, PBGA63,
HY27SS16561M-FIB HYNIX

获取价格

Flash, 16MX16, 10000ns, PBGA63, 9 X 11 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, FBGA-63
HY27SS16561M-FIP HYNIX

获取价格

Flash, 16MX16, 10000ns, PBGA63, 11 X 9 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, FBGA-63
HY27SS16561M-FIS HYNIX

获取价格

Flash, 16MX16, 10000ns, PBGA63, 11 X 9 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, FBGA-63
HY27SS16561M-FPCB HYNIX

获取价格

Flash, 16MX16, 10000ns, PBGA63, 9 X 11 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, FBGA-
HY27SS16561M-FPCP HYNIX

获取价格

Flash, 16MX16, 10000ns, PBGA63, 11 X 9 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, FBGA-
HY27SS16561M-FPCS HYNIX

获取价格

Flash, 16MX16, 10000ns, PBGA63, 11 X 9 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, FBGA-
HY27SS16561M-FPEB HYNIX

获取价格

Flash, 16MX16, 10000ns, PBGA63, 11 X 9 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, FBGA-
HY27SS16561M-FPEP HYNIX

获取价格

Flash, 16MX16, 10000ns, PBGA63, 11 X 9 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, FBGA-