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HY27SS16121A-SPCP PDF预览

HY27SS16121A-SPCP

更新时间: 2024-11-13 13:08:27
品牌 Logo 应用领域
海力士 - HYNIX 闪存
页数 文件大小 规格书
49页 414K
描述
Flash, 32MX16, 40ns, PDSO48, 12 X 17 MM, 0.65 MM HEIGHT, LEAD FREE, USOP1-48

HY27SS16121A-SPCP 技术参数

是否无铅:不含铅是否Rohs认证:符合
生命周期:Obsolete零件包装代码:SOIC
包装说明:12 X 17 MM, 0.65 MM HEIGHT, LEAD FREE, USOP1-48针数:48
Reach Compliance Code:compliantECCN代码:3A991.B.1.A
HTS代码:8542.32.00.51风险等级:5.84
Is Samacsys:N最长访问时间:40 ns
命令用户界面:YES数据轮询:NO
JESD-30 代码:R-PDSO-G48长度:15.4 mm
内存密度:536870912 bit内存集成电路类型:FLASH
内存宽度:16功能数量:1
部门数/规模:4K端子数量:48
字数:33554432 words字数代码:32000000
工作模式:ASYNCHRONOUS最高工作温度:70 °C
最低工作温度:组织:32MX16
封装主体材料:PLASTIC/EPOXY封装代码:VSSOP
封装等效代码:TSSOP48,.71,20封装形状:RECTANGULAR
封装形式:SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH页面大小:256 words
并行/串行:PARALLEL峰值回流温度(摄氏度):260
电源:1.8 V编程电压:1.8 V
认证状态:Not Qualified就绪/忙碌:YES
座面最大高度:0.65 mm部门规模:8K
最大待机电流:0.00005 A子类别:Flash Memories
最大压摆率:0.015 mA最大供电电压 (Vsup):1.95 V
最小供电电压 (Vsup):1.7 V标称供电电压 (Vsup):1.8 V
表面贴装:YES技术:CMOS
温度等级:COMMERCIAL端子形式:GULL WING
端子节距:0.5 mm端子位置:DUAL
处于峰值回流温度下的最长时间:20切换位:NO
类型:NAND TYPE宽度:12 mm
Base Number Matches:1

HY27SS16121A-SPCP 数据手册

 浏览型号HY27SS16121A-SPCP的Datasheet PDF文件第2页浏览型号HY27SS16121A-SPCP的Datasheet PDF文件第3页浏览型号HY27SS16121A-SPCP的Datasheet PDF文件第4页浏览型号HY27SS16121A-SPCP的Datasheet PDF文件第5页浏览型号HY27SS16121A-SPCP的Datasheet PDF文件第6页浏览型号HY27SS16121A-SPCP的Datasheet PDF文件第7页 
HY27US(08/16)121A Series  
HY27SS(08/16)121A Series  
512Mbit (64Mx8bit / 32Mx16bit) NAND Flash  
Document Title  
512Mbit (64Mx8bit / 32Mx16bit) NAND Flash Memory  
Revision History  
Revision  
History  
No.  
Draft Date Remark  
Sep. 2004 Preliminary  
0.0  
Initial Draft.  
1) Correct part number ( change mode)  
- 2A -> 1A (sequential row read : disable -> enable)  
2) Correct Table.5 & Table 12  
- Correct Command Set  
- correct AC timing characteristics (tWP : 40 -> 25ns, tWH : 20 ->15ns)  
3) Correct Summary description & page.7  
- The cache feature is deleted in summary description.  
- Note.3 is deleted. (page.7)  
0.1  
Oct. 22. 2004 Preliminary  
4) Add System interface using CE don’t care (page. 38)  
5) Change TSOP1, WSOP1,FBGA package dimension & figures.  
- Change TSOP1, WSOP1, FBGA package mechanical data  
- Change TSOP1, WSOP package figures  
6) Correct TSOP1, WSOP1 Pin configuration  
- 38th NC pin has been changed Lockpre (figure 2,3)  
7) Add Bad block Management  
1) LOCKPRE is changed to PRE  
- Texts, Table and figures are changed.  
2) Change Command set  
- Read A,B are changed to Read1.  
- Read C is changed to Read2.  
3) Change AC, DC characterics  
- tRB, tCRY, tCEH and tOH are added.  
4) Correct Program time (max)  
- before : 700us  
0.2  
Mar. 08. 2005 Preliminary  
- after : 500us  
5) Edit figures  
- Address names are changed.  
6) Change FBGA Package Dimension  
- FD1 : 1.70(before) -> 0.90(after)  
Rev 1.3 / Jun. 2006  
1

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